Dry Etch Process Engineer — AI-Driven Memory Tech

Micron; City of Albany (NY); On-site; USD 159,000 - 271,000; Full time

Job summary

Micron Technology, Albany NY site, seeks a Dry Etch Process Engineer to advance plasma etch processes for next‑generation memory devices. You will work hands‑on with etch equipment, metrology, and process characterization, collaborating across design, integration, and manufacturing to mature processes from R&D into high‑volume production.

Responsibilities include optimizing CD control, profile, and defect performance, leading DOE‑driven improvements, and partnering with vendors to implement

Qualifications

• MS/PhD in a relevant engineering or technical field and strong semiconductor processing background.
• 3+ years of semiconductor processing with emphasis on dry/plasma etch if BS.
• Experience with DOE planning/execution and statistical data analysis.

Responsibilities

• Develop, qualify, and sustain dry etch (plasma) unit processes for memory technologies.
• Optimize CD control, profile/anisotropy, selectivity, and uniformity.
• Drive defect reduction and yield improvement via inline/out-of-line metrology and DOE.
• Perform root-cause analysis and implement corrective actions for process excursions.
• Collaborate with equipment vendors on chamber matching and recipe development.
• Document process baselines and support transition to high-volume production.

Skills

DOE planning/execution

Statistical data analysis

Cross-functional collaboration

AI proficiency

Education

M.S. or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Mechanical Engineering

B.S. in a related engineering field

Tools

ICP/RIE platforms

Job description

Micron Technology, Albany NY site, seeks a Dry Etch Process Engineer to advance plasma etch processes for next‑generation memory devices. You will work hands‑on with etch equipment, metrology, and process characterization, collaborating across design, integration, and manufacturing to mature processes from R&D into high‑volume production.

Responsibilities include optimizing CD control, profile, and defect performance, leading DOE‑driven improvements, and partnering with vendors to implement