Staff ATE Test Engineer - SoC/TPU Test & Yield Leader

Google Inc.

Sunnyvale (CA)

On-site

USD 192,000 - 278,000

Full time

14 days+

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Benefits offered by this job

Equity

Job summary

Google is shaping the future of AI/ML hardware through advanced TPU technology. This role centers on defining robust silicon test solutions, architecture, and end-to-end test lifecycle in high-volume manufacturing.

You will lead cross-functional teams to ensure design-for-testability and quality across next-gen chips. You will collaborate with design, DFT, and manufacturing to deliver scalable test strategies, drive yield improvements, and support data center-grade silicon objectives for

Qualifications

  • Bachelor's degree in a related field or equivalent practical experience
  • 10+ years in test engineering, product engineering, or silicon quality/reliability
  • Experience in ASIC/SoC test development, bring-up or debug
  • Experience with scan/ATPG test development or memory BIST test development
  • Experience testing IPs such as PLLs, PMRO, eFuse, and temperature sensors
  • Experience with UCIE, HBM, PCIE, DDR
  • Experience with ATE from Advantest and Teradyne (EXA scale, UltraFlex+)

Responsibilities

  • Lead development and architectural definition of silicon test requirements
  • Define strategies for SoC product NPI, bring-up, verification, and qualification
  • Establish standards for post-silicon testing and cross-domain collaboration
  • Mentor teams to improve test coverage and quality
  • Drive test program architecture optimization and yield improvements

Skills

Test engineering
SoC test development
ASIC knowledge
Test automation
DFT/ATE strategies
Hardware verification

Education

Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field

Tools

Advantest EXA scale
Teradyne UltraFlex+
Load board design

Job description

Google is shaping the future of AI/ML hardware through advanced TPU technology. This role centers on defining robust silicon test solutions, architecture, and end-to-end test lifecycle in high-volume manufacturing.

You will lead cross-functional teams to ensure design-for-testability and quality across next-gen chips. You will collaborate with design, DFT, and manufacturing to deliver scalable test strategies, drive yield improvements, and support data center-grade silicon objectives for

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