Staff Assembly Process Engineer: Die Attach & Wirebond Lead

Nokia Corporation; Sunnyvale (CA); On-site; USD 120,000 - 180,000; Full time

Job summary

Nokia Corporation in Sunnyvale, CA seeks an experienced Process Engineer to own and improve COC assembly processes (wirebond & eutectic die attach) and mentor operators. You will organize experiments, lead tool selection and qualification, and coordinate with cross-functional teams to meet KPI targets in a 24/7 clean-room environment.

Ideal candidates have a strong hands-on background in microelectronics assembly, data analysis skills (JMP/MATLAB), and a track record of process optimization and

Qualifications

• Strong hands-on background in assembly technologies and processes for microelectronics manufacturing.
• Hands-on operation and maintenance of assembly process tools and metrology equipment.
• Technical expertise and ownership in die attach via solder or epoxy bonding on Micron2/Datacon EVO tool platform.
• Wafer fab or Assembly shop floor control systems.
• Process engineering statistics background (SPC, DOE).
• Experience with Failure Analysis.
• Material and Tool selection.
• Plasma cleaning equipment and process.
• Troubleshooting and resolving equipment problems.
• Hands-on data analysis with JMP, MATLAB, or similar packages.
• Experience in mentorship and training of operators, engineering technicians, and junior engineers.
• Ability to work closely and coordinate activities with other functional groups.
• Good communication and project management skills.
• Safety and quality-oriented mindset.

Responsibilities

• Become a process owner of many specific COC assembly processes, primarily wirebond and eutectic die attach.
• Peer-lead and develop expertise in specific assembly process modules as well as across the manufacturing process flow.
• Organize, analyze, and improve manufacturing processes to meet key performance indicators including efficiency, cycle time, yield, and reliability.
• Identify and reduce components of variability by conducting controlled experiments, analyzing, summarizing, and presenting results.
• Work in a team environment consisting of engineers, technicians and operators.
• Create written operational procedures and mentor/train operators.
• Responsible for New Tool selection , procurement , installation, and qualifying new tools.
• Work with development and other functional teams to define the assembly requirements for new product introduction.
• Identify, develop, and qualify new assembly processes and technologies to enable and support next generation product needs.
• Represent Assembly Engineering in various multi-functional teams.
• Work in a clean room environment and follow strict clean room requirements.
• Must be available for 24/7 factory on call.

Skills

Hands-on assembly

Data analysis

Mentorship

Project coordination

Safety mindset

Education

Bachelor's degree in electrical, mechanical, materials engineering

Tools

Micron2/Datacon EVO

Metrology equipment

Shop floor control systems

Job description

Nokia Corporation in Sunnyvale, CA seeks an experienced Process Engineer to own and improve COC assembly processes (wirebond & eutectic die attach) and mentor operators. You will organize experiments, lead tool selection and qualification, and coordinate with cross-functional teams to meet KPI targets in a 24/7 clean-room environment.

Ideal candidates have a strong hands-on background in microelectronics assembly, data analysis skills (JMP/MATLAB), and a track record of process optimization and