Manufacturing Engineer

NR Consulting; Torrance (CA); On-site; USD 80,000 - 130,000; Full time

Job summary

NR Consulting in Torrance, CA is seeking an engineer with hands-on microelectronics assembly experience to lead critical projects at our facility. The role blends technical expertise with project leadership, requiring a self-starter attitude in a dynamic environment.

Responsibilities include learning and applying die-bonding and wire-bonding processes, qualifying new products, and partnering with multi-functional teams to deliver robust wire-bond solutions.

Qualifications

• Bachelor’s degree in engineering and relevant manufacturing experience.
• Experience in PCBAs or microelectronics manufacturing processes.
• Minimum 2 years experience for Level II; 4 years for Level III; 6 years for Level IV.

Responsibilities

• Assist production team with die-bonding and wire-bonding processes, including equipment and tools.
• Qualify new products and lines at Torrance production site.
• Collaborate with cross-functional teams to develop wire-bond solutions for business needs.
• Provide training in die-assembly and wire-bond technology.

Skills

Die-assembly experience

Microscope operation

Analytical skills

Self-motivation

Interpersonal skills

Education

Bachelor's degree in mechanical, manufacturing, or electrical engineering

Tools

Die-bonding equipment

Wire-bonding machines

Precision pick-and-place

Job description

Salary: $80,000-$130,000/yr Depending on experience and level

We are seeking a motivated engineer with hands-on experience in microelectronics assembly to play a critical role at our facility in Torrance, CA. This role offers a unique opportunity to combine technical acumen with project leadership skills. The ideal candidate is a self-starter, comfortable working in a dynamic environment, and eager to take on a key role in highly visible projects.

Responsibilities

• Help production team with learning and understanding die-bonding, and wire bonding assembly processes, skills, tools, and equipment.
• Qualify new products and new product lines at Torrance production site.
• Collaborate with other functional groups to develop wire bond solutions to meet business needs.
• Provide training in die-assembly, wire bond technology, problem analysis and resolution.

Must have knowledge and understanding of:

• Ability to work under a microscope for extended periods of time
• Ability to have eye to hand dexterity and fine motor skills

Qualifications

• This role requires relevant engineering experience that includes a combination of or equivalent experience in manufacturing engineering of PCBAs, microelectronics, or similar manufacturing processes.
• Level II: requires a minimum of 2 years of relevant experience and a bachelor’s degree in mechanical, manufacturing, or electrical engineering discipline.
• Level III: requires a minimum of 4 years of relevant experience and a bachelor’s degree in mechanical, manufacturing, or electrical engineering discipline.
• Level IV: requires a minimum of 6 years of relevant experience and a bachelor’s degree in mechanical, manufacturing, or electrical engineering discipline.

Role also requires:

• Bachelor’s Degree in Materials, Chemical, Mechanical, Electrical & Electronic Engineering.
• Extensive experience with Microelectronic device process development including Eutectic die attach, precision pick and place and wire-bonding machines. Good analytical and problem-solving skills
• Self-motivated, able to work independently and self-initiative personality
• Possesses good communication skills, interpersonal skills and ability to work with multi-functional teams