Assembly Process Engineer: Die Attach & Wirebond (24/7)

Nokia Corporation; San Jose (CA); On-site; USD 120,000 - 190,000; Full time

Job summary

Nokia is seeking an experienced Assembly Engineer to develop, sustain, and improve process yield for die attach, wirebond, and inspection tools in a 24x7 manufacturing environment. You will own assembly processes, mentor operators, and drive improvements in efficiency, yield, and reliability.

Responsibilities include leading tool selection, installation, and qualification for new equipment, collaborating with development and cross-functional teams, and ensuring clean room compliance while

Qualifications

• Bachelor's degree in electrical, mechanical, materials engineering, or related field.
• 8+ years of related experience or a master's with 5 years in semiconductor packaging & assembly technology.

Responsibilities

• Own and improve COC assembly processes (wirebond, eutectic die attach).
• Lead and develop expertise across assembly process modules and manufacturing flow.

Skills

Hands-on assembly

Tool maintenance

Data analysis

Project management

Mentorship

Communication

Education

Bachelor's degree in Electrical/Mechanical/Materials Eng

Master's degree in related field

Tools

Micron2/Datacon EVO tool platform

SPC/DOE

Job description

Nokia is seeking an experienced Assembly Engineer to develop, sustain, and improve process yield for die attach, wirebond, and inspection tools in a 24x7 manufacturing environment. You will own assembly processes, mentor operators, and drive improvements in efficiency, yield, and reliability.

Responsibilities include leading tool selection, installation, and qualification for new equipment, collaborating with development and cross-functional teams, and ensuring clean room compliance while