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Nokia Corporation in Sunnyvale, CA seeks an experienced Process Engineer to own and improve COC assembly processes (wirebond & eutectic die attach) and mentor operators. You will organize experiments, lead tool selection and qualification, and coordinate with cross-functional teams to meet KPI targets in a 24/7 clean-room environment.
Ideal candidates have a strong hands-on background in microelectronics assembly, data analysis skills (JMP/MATLAB), and a track record of process optimization and
Develop, sustain, and improve process yield for die attach, wirebond, inspection tools and/or process steps in the assembly of monolithically integrated optical circuits in 24x7 manufacturing and development facility. Focus on both process and tool ownership, process, equipment performance (MTBA, MTBF) and NPI.
Bachelor's degree in electrical, Mechanical, Materials Engineering, or related field, plus 8 years of related experience, or master's degree with 5 years of experience in semiconductor packaging & assembly technology in a manufacturing environment.
Advancing connectivity to secure a brighter world.
Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we're advancing connectivity to secure a brighter world.
We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.
The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates.