Staff High-Power Laser Assembly Architect

Nokia

Sunnyvale (CA)

On-site

USD 180,000 - 260,000

Full time

14 days+

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Benefits offered by this job

Corporate Retirement Savings Plan

Health and dental benefits

Short-term and long-term disability

Life insurance and AD&D

Employee Stock Purchase Plan

Tuition Assistance Plan

Adoption assistance

Employee Assistance Program

Job summary

Nokia is seeking a Staff High-Power Laser Assembly Development Engineer in Sunnyvale to lead design and development of assembly processes for InP and GaAs lasers. You will drive reliability, cost, and manufacturability through advanced tooling, automation, and cross-functional collaboration across design, process, manufacturing, and quality teams.

You will mentor engineers, oversee qualification, and guide products from concept through high-volume manufacturing while advancing assembly

Qualifications

Advanced degree required (MS or PhD) in Mechanical Engineering, Materials Engineering, Physics, Photonics, or related discipline.
10+ years of industry experience in semiconductor laser packaging or assembly development.
Proven expertise in assembly design and process development for high-power InP and GaAs lasers.
Deep understanding of material interactions, die attach, mechanical stress, thermal management, and their impact on laser performance.
Hands-on experience with tooling, automation, characterization, process development, and failure analysis.
Experience performing or interpreting die attach stress simulations and related modeling.
Track record of product development leading to qualification and volume production.
Knowledge of manufacturing quality systems and reliability standards.

Responsibilities

Lead development of assembly designs and manufacturing processes for high-power InP and GaAs laser products.
Drive process innovation to meet performance, reliability, cost, and manufacturability targets.
Analyze interactions between materials, die attach, stress, thermal performance, and laser characteristics.
Develop and implement assembly tooling, automation, and characterization methodologies.
Perform die attach stress simulations and correlate results with product data.
Lead failure analysis investigations and implement corrective actions to improve yield.
Support product qualification activities and establish manufacturing quality controls.
Drive transition of new products from development to volume manufacturing.
Mentor engineers and grow assembly and packaging expertise within the organization.
Collaborate with cross-functional teams to address technical challenges and accelerate development.