Staff AI Systems Thermal Engineer

8224 Avago Technologies Wireless (U.S.A.) Manufacturing LLC; San Jose (CA); On-site; USD 120,000 - 210,000; Full time

Benefits offered by this job

Medical/Dental/Vision

401(k) match

ESPP

EAP

Paid holidays

Sick leave

Vacation time

Job summary

Broadcom, Inc. seeks an experienced AI Systems Thermal Engineer to lead end-to-end thermal design, simulation, optimization and validation of DLC cooling solutions for next‑gen AI accelerators and high-density compute platforms.

You will own thermal-hydraulic performance of cold plates, interface materials, and fluid subsystems to keep ASICs within safe limits at peak workloads. You will collaborate with silicon package designers, board layout, mechanical housing engineers, and manufacturers

Qualifications

• Education: Bachelor’s or Master’s degree in Mechanical or Thermal Engineering (M.S. preferred), or equivalent.
• Experience: Bachelors plus 8+ years of experience, or Masters plus 6+ years of experience.
• Hands-on experience in thermal/mechanical design for high-power electronics, AI hardware, servers, or HPC systems.
• Proven, direct experience designing and deploying Direct Liquid Cooling (DLC) systems, specifically liquid cold plates, coolant distribution units (CDUs), and manifold loops.

Responsibilities

• Thermal & CFD Modeling: Build and run detailed CFD and thermal-resistance models to evaluate temperature distribution, pressure drop, and flow balancing across cold plates, trays, and racks.
• Advanced Technology Implementation: Research cooling technologies and develop integration and test plans to validate these technologies and productionize them.
• Cold Plate Design & Optimization: Co-design high-performance liquid cold plates with industry partners to cool high-heat-flux AI processors.
• Thermal Interface Materials (TIM): Specify, select, and qualify TIMs for large devices to minimize contact resistance.
• System & Hydraulic Integration: Design coolant flow paths, QDs, hoses, and cold-plate retention mechanisms per server/Open Compute Project standards.
• Lab Validation & Testing: Plan and execute physical thermal testing including thermocouples, pressure/flow mapping, and correlation with simulations.
• Cross-Functional Collaboration: Work with mechanical, electrical, firmware, and supply chain teams from NPI to high-volume manufacturing.

Skills

Thermal design

Electronics cooling

Thermal testing

Education

Bachelor's or Master's in Mechanical/Thermal Engineering

Tools

Flotherm

FloEFD

MacroFlow

Python

MATLAB

LabVIEW

CREO

Job description

Job Description

We are looking for an experienced AI Systems Thermal Engineer to lead the end-to-end thermal design, simulation, optimization, and physical validation of Direct-to-Chip (D2C) liquid cooling solutions for next-generation AI accelerators and high-density compute platforms. In this role, you will own the thermal-hydraulic performance of custom cold plates, interface materials, and fluid delivery subsystems—ensuring our high-power ASICs operate within safe thermal limits at peak workloads. You will collaborate closely with silicon package designers, board layout teams, mechanical housing engineers, and manufacturing partners from concept through mass production.

Key Responsibilities

• Thermal & CFD Modeling: Build and run detailed Computational Fluid Dynamics (CFD) and thermal-resistance network models to evaluate temperature distribution, pressure drop, and flow balancing across cold plates, trays, and racks.


• Advanced Technology Implementation: Research advanced cooling technologies and develop integration and test plans to validate these technologies and convert them into production solutions.


• Cold Plate Design & Optimization: Co-design high-performance liquid cold plates with strategic industry partners to cool high-heat-flux AI processors.


• Thermal Interface Materials (TIM): Specify, select, and qualify thermal interface materials for large, high warpage, devices to minimize contact resistance between silicon dies and cold plates on large devices.


• System & Hydraulic Integration: Design coolant flow paths, quick-disconnects (QDs), hoses, and cold-plate retention/loading mechanisms in alignment with server chassis and OCP (Open Compute Project) standards.


• Lab Validation & Testing: Plan and execute physical thermal testing in the lab—including thermocouple instrumentation, pressure/flow mapping, thermal test vehicle (TTV) bring-up, and simulation-to-test correlation.


• Cross-Functional Collaboration: Partner with mechanical, electrical, firmware (thermal control algorithms), and supply chain teams to drive PCBA, tray and system level designs from NPI (New Product Introduction) to high-volume manufacturing.

Qualifications & Requirements

• Education: Bachelor’s or Master’s degree in Mechanical or Thermal Engineering (M.S. preferred), or equivalent.


• Experience: Bachelors plus 8+ years of experience, or Masters plus 6+ years of experience.


• Hands-on experience in thermal/mechanical design for high-power electronics, AI hardware, servers, or HPC systems.


• Proven, direct experience designing and deploying Direct Liquid Cooling (DLC) systems, specifically liquid cold plates, coolant distribution units (CDUs), and manifold loops.


• Technical Skills: Electronics Cooling: Deep understanding of single-phase and/or two-phase heat transfer, fluid dynamics, pressure drop calculations, and electronics packaging interactions.


• Experience with air cooled systems also an asset.


• Simulation Tools: High proficiency in CFD and thermal analysis software (preferably Flotherm, FloEFD, and MacroFlow).


• Lab Instrumentation: Experience with thermal data acquisition systems, flow meters, pressure transducers, and lab automation (Python, MATLAB, or LabVIEW).


• CAD & Mechanical Design: Experience with electronics packaging and CAD platforms, preferably CREO, an asset.

Compensation and Benefits

The annual base salary range for this position is USD To USD. As a valued member of our team, you’ll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Welcome! Thank you for your interest in Broadcom! We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions.

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