Mechanical Engineer Supporting ASIC Test

Broadcom Inc.

Fort Collins (CO)

On-site

USD 122,000 - 195,000

Full time

6 days ago
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Benefits offered by this job

Medical/Dental/Vision
401K with company match
Employee Stock Purchase Program (ESPP)
Employee Assistance Program (EAP)
Paid holidays, sick leave, vacation

Job summary

Broadcom Inc. seeks a senior Mechanical Engineer to develop thermal management and robust socketing solutions for ASIC test boards. You will collaborate with PCB design teams, perform design verification in SolidWorks, and handle 3D extractions from Allegro.

You’ll validate warpage with profilometry and manage vendors for socket hardware, testing, and cooling systems. You will work on high-power, high-ball-count ASIC devices, and contribute to continuous improvement with practical hands-on

Qualifications

  • Bachelor’s Degree in Mechanical Engineering with 8+ years developing semiconductor socket and cooling solutions.
  • SolidWorks used for design verification and validation.
  • Experience with Ansys Icepack and/or SolidWorks FLOW thermal analysis.
  • Experience with Ansys mechanical simulation software.
  • Vendor management in test hardware manufacturing processes.

Responsibilities

  • Collaborate with PCB electrical design engineers to provide robust ASIC socket and thermal solutions.
  • Perform mechanical component design and design verification using SolidWorks.
  • Perform 3D mechanical extractions from Allegro PCB design software.
  • Interface with device package designers and generate device warpage profiles.
  • Measure actual device warpage to validate warpage profile simulations using profilometry equipment.
  • Manage socket hardware vendors, review and approve designs.
  • Troubleshoot mechanical and electrical contact issues in lab/test floor environments.
  • Design and review cooling solutions (air, liquid, cold plate) for test hardware.
  • Evaluate and manage procurement of mechanical/test hardware such as thermal control units and socket resistance platforms.
  • 3D print team outputs to improve usability.

Skills

Design ownership
Team collaboration
Mechanical prototyping
Detail oriented
Socket design
Profilometry
Python scripting
Excel data
Vendor management
Lab troubleshooting

Education

Bachelor’s Degree in Mechanical Engineering
8+ years semiconductor socket and cooling experience
Master’s Degree + 6 years experience (optional)

Tools

SolidWorks
Ansys Icepack
Ansys FLOW
Ansys Mechanical
Allegro 3D extraction
Python
Excel
Profilometry
Keyence

Job description

Job Description

A mechanical engineering position responsible for developing thermal management and robust socketing solutions for test and validation PCBs for Broadcom ASIC products targeted at hyperscale data center applications. Broadcom’s market leading products are enabling the next generation of AI and cloud storage.

Essential Duties and Responsibilities
  • Collaborate with PCB electrical design engineers to provide robust ASIC socket and thermal solutions for their designs.
  • Perform mechanical component design and design verification using Solidworks.
  • Perform 3d mechanical extractions from Allegro PCB design software.
  • Interface with device package designers and generate device warpage profiles for socket designs from raw simulations data.
  • Measure actual device warpage to validate warpage profile simulations using high precision profilometry equipment.
  • Manage socket hardware vendors, review, provide feedback, and approve designs.
  • Troubleshoot mechanical and electrical contact issues in lab and test floor environments.
  • Design and review cooling solutions (air, liquid, cold plate) for test hardware.
  • Evaluate and manage procurement of mechanical and test hardware such as thermal control units, socket resistance measurement platforms, etc.
  • 3d print the team’s way out of headaches and usability issues.
The Successful Candidate Will
  • Have a strong sense of design ownership.
  • You enjoy collaborating with the engineers using your mechanical solutions and working with them to generate improvements.
  • Have good mechanical prototyping skills.
  • Be extremely detail oriented.
  • Be familiar with the issues involved in socketing and cooling very large, high power, high ball-count ASIC devices.
  • Have experience with pogo-pin and elastomeric IC socket solutions.
  • Have good mechanical debug intuition and be comfortable with all basic hand tools, micrometers, calipers, etc.
  • Have base knowledge of ATE test hardware mechanical configurations.
  • Have familiarity with Keyence profilometry equipment.
  • Have skills in manipulating large data sets in tools such as Excel or in scripts in Python.
  • Have a passion for continuous improvement and a commitment to creating quality output.
  • Exhibit strong teamwork skills as part of a fast moving, multi-site team.
  • Have excellent interpersonal skills and be comfortable managing vendors and internal team customers alike.
Qualifications
  • Bachelor’s Degree in Mechanical Engineering and 8+ years of experience (or a Master’s Degree + 6 years of experience) developing semiconductor socket and cooling solutions.
  • In depth experience using Solidworks.
  • Experience using Ansys Icepack and/or Solidworks FLOW thermal analysis and simulation software.
  • Experience using Ansys mechanical simulation software.
  • Experience managing vendors in the test hardware manufacturing process.
Compensation and Benefits

The annual base salary range for this position is USD 121,900.00 To USD 195,000.00

As a valued member of our team, you’ll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company’s growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package:

  • Medical, dental and vision plans
  • 401(K) participation including company matching
  • Employee Stock Purchase Program (ESPP)
  • Employee Assistance Program (EAP)
  • company paid holidays
  • paid sick leave and vacation time

The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.

We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Welcome! Thank you for your interest in Broadcom! We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. For more information please visit our video library and check out our Connected by Broadcom series.

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