Sr. Product Engineer (Power Module): $125-195K+

IC Resources; Tempe (AZ); Hybrid; USD 120,000 - 180,000; Full time

Job summary

IC Resources is partnering with a Global Leader in the Semiconductor Industry to hire a Sr. Product Engineer (Power Systems/Packaging) for AI power products. This hybrid role is based in Tempe, AZ or Austin, TX, with local candidates and those willing to relocate after offer being considered.

Corp-to-Corp and visa sponsorship are not offered. The role emphasizes leading product engineering, overseeing power modules, and driving NPIs through high-volume manufacturing while ensuring IPC-A-610

Qualifications

• 5+ years of product/manufacturing engineering experience in the semiconductor industry.
• Experience manufacturing power modules and advanced power products for the semiconductor industry.
• Experience with high-volume manufacturing transfer, qualification, and new product development.
• Experience driving product development from NPI through high-volume manufacturing.
• Strong understanding of IPC-A-610 workmanship standards.
• Experience with die attach, clip attach, module defects, solder integrity, etc.
• Experience defining specs for manufacturing capability and silicon behavior.
• Participation in release, execution, and PCNs.
• Experience using data and statistical analysis in decision making.

Responsibilities

• Lead product engineering from NPI to high-volume manufacturing.
• Oversee power modules and advanced power products manufacturing.
• Drive manufacturing transfer, qualification, and new product development.
• Define specs for manufacturing capability and silicon behavior.
• Use data and statistical analysis to guide decisions.

Skills

Product engineering

Semiconductor experience

Data-driven decisions

NPI experience

High-volume manufacturing

Job description

We are very excited about our exclusive partnership with a Global Leader in the Semiconductor Industry in their search for a Sr. Product Engineer (Power Systems/Packaging) for their new AI Power Products. This is an amazing opportunity to be part of an extremely successful/stable company as they continue to capture market-share in Deep-Tech and Artificial Intelligence.

This is a Hyrbrid Position in Tempe, AZ or Austin, TX. Only Local Candidates and Those Willing to Relocate Soon After an Offer Will Be Considered.

We Cannot Consider Any Corp-to-Corp Candidates or those Requiring Visa Sponsorship of Any Kind

Why This is The Product Engineer (Power Systems/Packaging) Role for You

• Highly Competitive Base Salary + Bonus + Equity
• Big Name Company in a Thriving/Stable Industry (Great Job Security and Growth)
• Hybrid Work
• Ability Help Deliver and Impact Some of the Most Innovative/Necessary Products in Technology Today (Intersection of Semiconductor and AI)

What We're Looking for in a Product Engineer(Power Systems/Packaging)

• 5+ Years Product/Manufacturing Engineering Experience in the Semiconductor Industry
• Expertise in the Manufacturing of Power Modules and Advanced Power Products for the Semi Industry
• Experience Working with High-Volume Manufacturing Transfer: Qualification, and New Product Development
• Experience Driving Product Development from NPI through High-Volume Manufacturing
• Strong Understanding with workmanship standards: IPC-A-610 (Acceptability of Electronic Assemblies)
• Familiarity with Assembly-Related Excursions: Die Attach, Clip Attach, Module Defects, Solder Integrity, etc.
• Experience with Product Bring Up, Characterization, Silicon Readiness
• Experience Defining Specs for Manufacturing Capability and Silicon Behavior
• Former Participation in Release, Execution, and PCN's
• Experience Using Data/Statistical Analysis in Decision Making