Sr. Principal Analog/RF/Mixed Signal IC Design & Development

NOKIA

Allentown (Lehigh County)

On-site

USD 180,000 - 280,000

Full time

8 days ago
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Job summary

Nokia is seeking a senior expert to lead the design and development of high-speed Transmit (TIA) and Receive (MZMD) components for coherent long-haul and metro optical networks, and PAM4 data center systems. You will drive architectures, perform silicon bring-up, and collaborate with cross-functional teams using SiGe BiCMOS and CMOS processes.

The role requires a track record in analog/RF ASIC design, strong problem-solving, and the ability to mentor engineers while delivering robust, scalable

Qualifications

  • Master's or Ph.D. in Electrical Engineering with 10+ years in Analog/RF ASIC design and development.
  • Demonstrated experience in high-speed Analog/RF IC designs (TIA, MZMD) with SiGe BiCMOS technology.
  • Deep understanding of transistor-level design, device physics, and stabilization of feedback loops.
  • Knowledge of transmission lines and high-frequency passive structures.
  • Strong communication and collaboration across groups.

Responsibilities

  • Design and development of Transmit (TIA) and Receive (MZMD) components for optical networks.
  • Innovate architectures using advanced process nodes; prepare processes for product development.
  • Oversee IC product development: design, layout, silicon bring-up and characterization.
  • Collaborate with product engineering and optical system groups to refine specs.
  • Contribute to design reviews and ensure adherence to Nokia standards.
  • Provide technical guidance and mentorship to junior engineers.

Skills

SiGe BiCMOS
Analog/RF ASIC design
High-speed circuits
Transmitter (TIA) and Receiver (MZMD)
Team mentoring

Education

Master's or Ph.D. in Electrical Engineering

Tools

EDA CAD tools
3D EM modeling
RF wafer probing

Job description

Join Nokia's advanced photonics and semiconductor design team, developing next-generation analog ICs for high-speed optical communication systems. In this role, you will design and lead development of high speed Transmit (TIA) and Receive (MZMD) components for coherent long-haul and metro systems as well as PAM4 data center systems, primarily using SiGe BiCMOS and CMOS processes.

You will play a key role in delivering innovative solutions that enable faster, more efficient data transmission across data centers and telecommunications networks, and emerging AI-driven infrastructure.


  • Responsible for design and development of Transmit (TIA) and Receive (MZMD) components for optical network systems (Coherent, PAM4, etc.).
  • Innovate and develop new architecture utilizing advanced process nodes, preparing these processes for subsequent product development.
  • In charge of many aspects of IC product development, such as design, layout, silicon bring-up and characterization.
  • Collaborate with product engineering and optical system groups to evaluate, develop, and refine "white box" specifications into detailed electrical specifications for both Tx and Rx components.
  • Provide significant technical contributions to design reviews, verifying design integrity and adherence to standards.
  • Work with ASIC group by applying Nokia documentation standards to optimize development cycles.
  • Offer technical guidance and share best practices in optical network design and development to mentor new hires and junior team members.

  • Master's (M.S.) or Ph.D. degree in Electrical Engineering with a minimum of 10 years of related experience in Analog/RF ASIC design and development
  • Demonstrated experience in high-speed Analog/RF IC designs (TIA, MZMD) with SiGe BiCMOS technology
  • Proven experience in
    • Low noise / high linear (>80GHz) broadband analog circuits for optical front-end
    • High-precision analog circuits (e.g., linear regulators, bandgaps, DAC/ADC).
  • Deep understanding of detailed transistor-level design, device physics, and control/feedback loop stability analysis
  • Knowledge of transmission lines and other high-frequency passive structures
  • Strong understanding of package and board-level design optimization
  • Experience with RF wafer probing, lab equipment, and evaluation of high-speed analog ICs
  • Demonstrated ability to independently resolve complex organizational and technical challenges
  • Solid expertise with EDA CAD tools, custom analog layout, 3D EM modeling
  • Strong problem-solving and decision-making capabilities
  • Highly- self-motivated, detail-oriented, and results-driven
  • Must be a team player with good verbal and written communication skills
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