Sr. Director Analog/RF/Mixed Signal IC Design & Development

NOKIA; Sunnyvale (CA); On-site; USD 300,000 - 460,000; Full time

Job summary

Nokia seeks a Senior Director to lead the SiGe Analog/RF/Mixed-Sign al ASIC team, owning architecture, design, test, and productization from definition through tape-out. You will scale and mentor diverse engineers, drive cutting-edge, high-frequency, low-noise circuits (TX/RX) and collaborate across foundries and packaging to deliver reliable, market-leading solutions for our optical engine development.

MS or PhD with 15+ years in Analog/RF/ mixed-signal ASIC design and leadership is required;

Qualifications

• >15 years of progressive experience in Analog/RF/ Mixed-Signal ASIC design and leadership.
• Proven track record in SiGe BiCMOS/CMOS design leading to productization.
• Strong leadership of diverse technical teams.

Responsibilities

• Lead and mentor the Analog/RF ASIC Design Team, overseeing product definition, chip architecture, design, foundry selection/interactions, test, and productization.
• Strategically manage and scale the team to deliver Analog/RF ASIC solutions crucial for Nokia's optical engine development.
• Implement and enforce robust design methodologies and processes to ensure high quality and reliability.
• Drive exploration and selection of optimal circuit topologies to achieve market-leading performance.
• Collaborate with cross-functional teams to define product requirements and development roadmaps.
• Lead interactions with internal and external partners on foundry processes, packaging, test, and qualification.
• Oversee the complete IC/Chip product development lifecycle, including specification, design, layout, tape-out, bring-up, test, and reliability.
• Partner with verification, CAD, product, and test engineering teams to devise and execute DVT plans and characterization.

Skills

Strategic leadership

Analog design

RF design

SiGe BiCMOS

Team leadership

Foundry interactions

DVT/characterization

RF layout

Cross-functional collaboration

Product roadmaps

Education

MS or PhD

Tools

3D EM simulations

Job description

We are seeking a highly accomplished Senior Director to lead our SiGe Analog/RF/Mixed-Signal ASIC development team.

This role requires demonstrated strategic leadership in managing complex projects and a deep technical expertise in high-performance, high-frequency, and low-noise broadband analog & RF circuit/chip design, including TX (MZMD), RX (TIA), and supporting circuits.

The ideal candidate will possess extensive experience in leading diverse technical teams, fostering innovation, and driving product development from definition through design and production in a fast-paced environment.

• Lead and mentor the Analog/RF ASIC Design Team, overseeing product definition, chip architecture, design, foundry selection/interactions, test, and productization.
• Strategically manage and scale the team to deliver cutting-edge Analog/RF ASIC solutions crucial for Nokia's optical engine development.
• Implement and enforce robust design methodologies and processes to ensure the highest product quality and reliability.
• Drive the exploration and selection of optimal circuit topologies to achieve market-leading product performance.
• Collaborate with cross-functional teams to define comprehensive product requirements and development roadmaps.
• Lead interactions with internal and external partners on foundry processes, packaging, test, and qualification efforts.
• Oversee the complete IC/Chip product development lifecycle, including specification, design, layout, tape-out, silicon bring-up, test, and reliability.
• Partner closely with verification, CAD, product, and test engineering teams to devise and execute comprehensive DVT plans and characterization.

• Master's (M.S.) or Ph.D. degree in Electrical Engineering with a minimum of 15 years of progressive experience in Analog/RF ASIC design and leadership.
• Proven track record of analog/RF/mixed-signal SiGe BICMOS, CMOS ICs first-pass success in design leading to productization.
• Demonstrated experience in leading and developing high-performing, diverse technical teams.
• Extensive knowledge in high-speed, high-performance, low-noise Analog/RF circuitry.
• Strong understanding of Analog/RF/mixed signal layout techniques and best practices.
• Solid understanding of 3D EM simulation tools.
• Knowledge of RF wafer probing, lab equipment, and evaluation of high-speed analog ICs.
• Strong understanding of package and board-level design optimization.
• Fluent in verbal and written communications.
• Demonstrated ability to independently resolve complex organizational and technical challenges.
• Highly self-motivated, detail-oriented, and results-driven.
• Strategic cross-functional leadership.
• Strategic thinking and business acumen related to product roadmaps and market trends.
• Strong problem-solving and decision-making capabilities.