Spaceflight Hardware Intern: LAMS Assembly & Test

Leidos; Huntsville (AL); On-site; USD 28,000 - 41,000; Full time

Benefits offered by this job

Mentorship by experienced engineers

Hands-on hardware exposure

Opportunity to work on NASA Artemis/LX

Job summary

Leidos seeks a talented Engineering student for a Summer Internship in Huntsville, AL to support the Laser Air Monitoring System (LAMS) program. You will work alongside experienced engineers and technicians during an active flight-hardware production cycle, contributing to assembly, integration, testing, and data analysis.

The role involves collaboration across mechanical, electrical, optical, software, manufacturing, and systems engineering disciplines, with opportunities to learn procedures,

Qualifications

• Pursuing a Bachelor's degree in Mechanical Engineering, Aerospace Engineering, Electrical Engineering, or similar.
• Anticipated graduation in 2027 or 2028.
• Overall GPA of 3.0 or higher.
• Must be a U.S. Citizen.
• On-site work in Huntsville, AL.

Responsibilities

• Support flight hardware assembly, integration, and test activities for LAMS.
• Collaborate with engineers and technicians during build and integration.
• Assist with test procedures, data collection, and analysis.
• Prepare for PSRs and TRRs and other technical reviews.
• Support documentation and configuration management for flight hardware.

Skills

CAD experience

Multidisciplinary teamwork

Hands-on engineering

Problem solving

Able to lift up to 30 lbs

Education

ABET-accredited ME/AE/Electrical Engineering

Bachelor's degree, graduation 2027/2028

Tools

CAD software

Microsoft Office

PowerPoint

Job description

Leidos seeks a talented Engineering student for a Summer Internship in Huntsville, AL to support the Laser Air Monitoring System (LAMS) program. You will work alongside experienced engineers and technicians during an active flight-hardware production cycle, contributing to assembly, integration, testing, and data analysis.

The role involves collaboration across mechanical, electrical, optical, software, manufacturing, and systems engineering disciplines, with opportunities to learn procedures,