Get a reply from this employer
Your resume and cover letter, tailored to exactly what they’re hiring for.
Micron Technology is seeking a SoC Architecture and Design Engineer in Folsom, CA. In this role, you will be responsible for architecting, designing, and integrating next-generation HBM SoC logic die. The ideal candidate will work closely with various teams to deliver high-performance solutions that meet power and performance targets.
The position requires a Bachelor's or master's degree in electrical engineering and a minimum of 15 years of experience. Proficiency in SystemVerilog and familiarity with SoC integration methodologies are essential.
As a SoC Architecture and Design Engineer in the Heterogeneous Integration Group (HIG), you will architect, design, develop, and integrate next‑generation HBM SoC logic die. You will collaborate with architecture, design, verification, physical design, firmware, and product teams to deliver powerful, high‑performance SoC solutions that meet demanding power, performance, area, and schedule targets.
US base salary range: $177,000 - $334,000 per year.
Additional compensation may include bonuses and equity.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.