New College Grad - HBM SoC Design Engineer/Architect

Micron Technology, Inc; Folsom (CA); On-site; USD 122,000 - 166,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc is seeking an HBM SoC Design Engineer/Architect to contribute to the design, integration, and validation of advanced HBM logic dies and memory-centric SoCs. You will collaborate across architecture, RTL design, verification, and firmware to deliver high-performance memory solutions.

This role emphasizes digital design and ASIC development with exposure to HBM architecture, AI-assisted engineering methods, and cross-functional teamwork to meet power, performance, and

Qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field completed prior to the employment start date.
• Experience with digital design, ASIC development, or FPGA design or related discipline.
• Strong knowledge of Verilog, SystemVerilog, VHDL, or other hardware description languages.

Responsibilities

• Design, implement, and integrate digital logic and subsystem RTL using Verilog or SystemVerilog for next-generation HBM SoC solutions.
• Collaborate with architects and cross-functional engineering teams to translate functional requirements into microarchitectures and implementations.
• Support design-quality activities including simulation, synthesis, STA, CDC analysis, debugging, and design reviews.
• Evaluate power, performance, area, and timing tradeoffs to develop data-driven technical recommendations.
• Develop automation solutions and leverage AI assisted workflows to improve productivity and verification efficiency.

Skills

Verilog

SystemVerilog

VHDL

Digital design

ASIC development

FPGA design

Education

Bachelor's degree in Electrical Engineering or Computer Engineering

Tools

Synthesis

Static timing analysis

Simulation

Formal verification

UVM

FPGA prototyping

EDA tools

Job description

About the Team

At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) develops next-generation High Bandwidth Memory (HBM) solutions that enable advanced AI, high-performance computing, data center, and networking applications. Our team collaborates across architecture, RTL design, verification, physical design, firmware, and product engineering to deliver innovative memory-centric SoC solutions that meet demanding power, performance, area, quality, and schedule objectives.

Position Overview

As an HBM SoC Design Engineer/Architect, you will contribute to the design, integration, and validation of advanced HBM logic die and memory-centric SoCs. Working alongside experienced engineers, you will apply knowledge gained through academic coursework, research, internships, and engineering projects to solve real-world semiconductor design challenges. This role offers opportunities to develop expertise in digital design, ASIC development, HBM architecture, and AI-enabled engineering methodologies that improve design productivity and quality.

Responsibilities

• Design, implement, and integrate digital logic and subsystem RTL using Verilog or SystemVerilog for next-generation HBM SoC solutions.
• Collaborate with architects and cross-functional engineering teams to translate functional requirements into microarchitectures, interface definitions, and implementation plans.
• Support design-quality activities including simulation, synthesis, static timing analysis, clock-domain crossing (CDC) analysis, debugging, and design reviews.
• Evaluate power, performance, area, and timing tradeoffs to develop data-driven technical recommendations and improve design quality.
• Develop automation solutions and leverage AI Assisted workflows, Generative AI, Large Language Models (LLMs), or Agentic AI technologies to improve engineering productivity, verification efficiency, and design analysis.

Minimum Qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field completed prior to the employment start date.
• Academic, research, internship, or project experience in digital design, ASIC development, FPGA design, computer architecture, or a related discipline.
• Working knowledge of Verilog, SystemVerilog, VHDL, or another hardware description language.
• Understanding of digital design fundamentals including finite-state machines (FSMs), pipelining, clocking, reset strategies, timing concepts, and synchronous logic.
• Strong analytical, problem-solving, written communication, and verbal communication skills with the ability to work effectively in collaborative engineering environments.

Preferred Qualifications

• Master's or Ph.D. degree in Electrical Engineering, Computer Engineering, or a related technical discipline completed prior to the employment start date.
• Coursework, research, internship, or project experience in SoC design, RTL development, design verification, physical design, embedded systems, or semiconductor technologies.
• Familiarity with synthesis, static timing analysis (STA), simulation, formal verification, UVM, FPGA prototyping, or industry-standard EDA tools.
• Understanding of memory systems and high-speed interfaces such as HBM, DDR, LPDDR, PCIe, or CXL.
• Experience with automation, AI Enabled development tools, Generative AI, Large Language Models (LLMs), AI Assistants, or Agentic AI solutions applied to semiconductor design, validation, or engineering workflows.

Job Profile(s):

Systems Design Engineer 1 - Systems Design Engineer 3

Relocation Level: TBD

The US base salary range that Micron Technology estimates it could pay for this full-time position is:

$79,000.00 - $210,000.00 a year

Additional compensation may include benefits, bonuses and equity.

Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays.

For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.