HBM SoC Physical Design Engineer

1000 Micron Technology, Inc.; Folsom (CA); On-site; USD 121,000 - 205,000; Full time

Benefits offered by this job

Medical, dental, vision plans

Equity options

Paid time off

Job summary

Micron Technology is seeking a SoC Physical Design Engineer in the Heterogeneous Integration Group to drive implementation from netlist to GDSII. The role requires coordinating with RTL, verification, packaging, and manufacturing to meet PPA targets and signoff for tape-out.

The engineer will own blocks or top-level integration, work on AI-enabled workflows, and ensure manufacturability through DRC/LVS and EM/IR considerations.

Qualifications

• Experience in SoC physical design from netlist to GDSII on advanced nodes.
• Proficiency with industry EDA tools (Cadence, Synopsys, Calibre).
• Solid understanding of STA, clocks, constraints (SDC) and closure techniques.
• Knowledge of UPF/CPF power considerations and power delivery.
• Familiarity with physical verification and signoff concepts (DRC/LVS).

Responsibilities

• Own physical implementation for SoC blocks/top-level, including floorplanning and routing.
• Drive timing closure across MMMC scenarios with STA/signoff collaboration.
• Integrate IP blocks for robust physical integration and timing/power integrity.
• Perform and coordinate physical signoff, addressing violations efficiently.
• Collaborate with packaging, assembly, test, and manufacturing teams.

Skills

SoC physical design

Timing closure

Power integrity

DFT/MBIST awareness

Scripting/automation

Education

Bachelor’s or Master’s in electrical/computer engineering

Tools

Cadence Innovus/Tempus

Synopsys ICC2/PrimeTime

Siemens Calibre

Job description

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Physical Design Engineer in the Heterogeneous Integration Group (HIG), you will drive the implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will work closely with RTL design, verification, DFT, IP providers, packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff collateral for tape‑out. This is a hands‑on role with opportunities to own blocks or top‑level integration across multiple product generations. You will also work on efforts to enable and integrate AI‑driven tools and AI‑enabled workflows into the team's methodologies.

Key Responsibilities

• Own physical implementation for SoC blocks and/or top‑level, including floor‑planning, placement, CTS, routing, and physical optimization to meet PPA targets.
• Drive timing closure (setup/hold) across multi‑mode/multi‑corner (MMMC) scenarios; partner with RTL, architecture, and STA/signoff to converge designs.
• Integrate and implement complex IP (e.g., controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, PHY‑adjacent logic) with focus on robust physical integration and timing/power integrity.
• Perform and/or coordinate physical signoff, including DRC/LVS, IR drop/EM, and timing signoff, addressing violations efficiently.
• Partner with DFT teams to ensure scan/MBIST requirements are physically realizable and do not compromise PPA or schedule.
• Work with packaging, assembly, test, probe, and manufacturing collaborators to ensure builds meet manufacturability and quality requirements.
• Support tape‑out execution (checklists, ECO flows, signoff reviews) and contribute to post‑silicon debug by correlating silicon behavior with PD/STA/power analysis.
• Identify flow gaps and improve productivity through scripting/automation and best‑practice methodology development.

Required Qualifications

• Strong experience in SoC physical design implementation from netlist to GDSII on advanced nodes and complex designs.
• Proficiency with industry EDA tools (e.g., Cadence Innovus/Tempus, Synopsys ICC2/PrimeTime, Siemens Calibre or equivalent).
• Solid understanding of STA fundamentals, clocking, constraints (SDC), and common closure techniques (buffering, path shaping, useful skew, etc.).
• Experience with power intent and power delivery considerations (e.g., UPF/CPF concepts, power grid planning, power gating implications).
• Familiarity with physical verification/signoff concepts: DRC, LVS, ERC, parasitic extraction awareness, and signoff handoff quality.

Preferred Qualifications

• Experience with HBM / DRAM adjacent SoC designs, or memory‑subsystem‑heavy SoCs.
• Bachelor’s or master’s degree in electrical engineering, Computer Engineering, or a related field.
• Minimum 3 years of experience in a related field.
• Proven ability to mentor and develop engineers early in their careers.
• Good understanding of Agentic AI or willingness to learn Agentic AI to help develop efficient workflow.

The US base salary range that Micron Technology estimates it could pay for this full‑time position is: $121,000.00 - $205,000.00 a year Additional compensation may include benefits, bonuses and equity. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job‑related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.

• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time‑off program and paid holidays.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.