Silicon Co-Design Architect: Power, Thermal & Packaging

NVIDIA; United States; Hybrid; USD 196,000 - 368,000; Full time

Benefits offered by this job

Equity

Benefits package

Job summary

NVIDIA is seeking a transformative Co-Design Architect to push the physical limits of chip capabilities across architecture, silicon, systems, and manufacturing. You will identify constraints that erode competitiveness and craft cross-domain responses to ensure the next generation leapfrogs those limits.

The role is centered on cross-functional influence, packaging technology evaluation, and system-manufacturing co-design to deliver high-performance GPUs/CPUs with testable reliability and

Qualifications

• BS/MS/PhD in EE, Physics, or CE (or equivalent experience).
• 12+ years relevant experience.
• Deep understanding of power delivery, thermal dissipation, and current density in high-performance GPU/CPU systems.
• Proven ability to convert physical-limit trends into impact, measures and solutions.
• Demonstrated cross-functional influence across building, packaging, manufacturing, and test organizations.

Responsibilities

• Power, Thermal & Packaging Limits Analysis: Gather and analyze the hard constraints of packaging, power delivery, and thermal dissipation against roadmap demands, predicting when those constraints will reduce competitiveness and acting before they do.
• Cross-Domain Solution Development: Develop solutions that span silicon features, packaging innovation, firmware and hardware co-design, and DFX updates, ensuring future products are not only performant but testable to the highest quality and reliability standards.
• Packaging Technology Evaluation: Assess emerging packaging technologies for their voltage/frequency, noise, reliability, and testability implications, determining which are worth adopting and the trade-offs each choice entails across the full system.
• System-Manufacturing Co-Design: Drive improvements in product performance, performance-per-watt, and provisioning efficiency through system-manufacturing co-design, with the scope to follow the work wherever the highest-impact opportunities lead, whether that's power, thermal, or adjacent domains.

Skills

Power delivery

Thermal dissipation

Cross-functional influence

Education

BS/MS/PhD in EE, Physics, or CE

Job description

NVIDIA is seeking a transformative Co-Design Architect to push the physical limits of chip capabilities across architecture, silicon, systems, and manufacturing. You will identify constraints that erode competitiveness and craft cross-domain responses to ensure the next generation leapfrogs those limits.

The role is centered on cross-functional influence, packaging technology evaluation, and system-manufacturing co-design to deliver high-performance GPUs/CPUs with testable reliability and