Senior Co-Design Architect: Power, Thermal & Packaging

Nvidia Corporation; Santa Clara (CA); Hybrid; USD 196,000 - 368,000; Full time

Benefits offered by this job

Equity

Competitive compensation

Job summary

NVIDIA’s Silicon Co-Design Group is seeking a senior engineer to push the physical limits of what a chip can do. You’ll analyze power delivery, thermal dissipation, and packaging constraints, and design cross-domain solutions that keep NVIDIA at the cutting edge of silicon innovation.

You’ll lead multi-disciplinary work across electrical, thermal, mechanical and manufacturing domains, shaping the next generation of GPUs and CPUs with equity and competitive compensation.

Qualifications

• BS/MS/PhD in EE, Physics, or CE (or equivalent experience).
• 12+ years relevant experience.
• Deep understanding of power delivery and thermal dissipation in high-performance GPU/CPU systems.
• Proven ability to convert physical-limit trends into impact and solutions.
• Cross-functional influence across building, packaging, manufacturing and test organizations.

Responsibilities

• Analyze power, thermal and packaging limits to forecast competitiveness and guide design choices.
• Develop cross-domain solutions spanning silicon, packaging, firmware and hardware co-design.
• Evaluate packaging technologies for voltage, noise, reliability and testability trade-offs.
• Drive system-manufacturing co-design to improve performance, efficiency and provisioning.

Skills

Power delivery & thermal

Cross-functional influence

AI for problem-space modeling

Multi-domain problem solving

Education

BS/MS/PhD in EE/Physics/CE

Job description

NVIDIA’s Silicon Co-Design Group is seeking a senior engineer to push the physical limits of what a chip can do. You’ll analyze power delivery, thermal dissipation, and packaging constraints, and design cross-domain solutions that keep NVIDIA at the cutting edge of silicon innovation.

You’ll lead multi-disciplinary work across electrical, thermal, mechanical and manufacturing domains, shaping the next generation of GPUs and CPUs with equity and competitive compensation.