Senior Co-Design Architect: Power, Thermal & Packaging Futures

NVIDIA; Hillsboro (OR); On-site; USD 196,000 - 368,000; Full time

Benefits offered by this job

Equity

Job summary

NVIDIA is seeking a seasoned Co-Design Architect to push the physical limits of chip design in a role that crosses architecture, silicon, systems, and manufacturing. You will identify where constraints erode competitiveness and craft cross-domain responses to leap beyond existing bounds.

Responsibilities include analyzing packaging, power delivery, and thermal limits against roadmaps, and developing solutions that ensure testability and reliability across future products.

Qualifications

• 12+ years relevant experience in hardware architecture or silicon co-design.
• Deep understanding of power delivery, thermal dissipation, and current density in high-performance GPU/CPU systems.

Responsibilities

• Power, Thermal & Packaging Limits Analysis: gather and analyze constraints against roadmap demands.
• Cross-Domain Solution Development: span silicon, packaging, firmware/hardware co-design and DFX updates.
• Packaging Technology Evaluation: assess emerging packaging tech for voltage, noise, reliability, and testability implications.
• System-Manufacturing Co-Design: drive improvements in performance, performance-per-watt, and provisioning efficiency.

Skills

Power delivery

Thermal analysis

Cross-domain collab

Packaging knowledge

Education

BS/MS/PhD in EE, Physics or CE

Job description

NVIDIA is seeking a seasoned Co-Design Architect to push the physical limits of chip design in a role that crosses architecture, silicon, systems, and manufacturing. You will identify where constraints erode competitiveness and craft cross-domain responses to leap beyond existing bounds.

Responsibilities include analyzing packaging, power delivery, and thermal limits against roadmaps, and developing solutions that ensure testability and reliability across future products.