Signal Integrity PCB Design Engineer — High-Density Boards

Microchip Technology Inc.

Mount Holly Springs (Cumberland County)

On-site

USD 90,000 - 130,000

Full time

13 days ago
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Job summary

Microchip Technology Inc. in Mount Holly Springs, PA, is seeking a skilled Signal Integrity PCB Design Engineer to drive high-density, multi-layer PCB designs with a focus on signal integrity, manufacturability, and reliability.

The ideal candidate has a strong background in SI and PCB layout and will contribute to cutting-edge timing solutions for diverse industries. This on-site role reports to the Mount Holly Springs facility, involves collaboration with design and process engineers, and

Qualifications

  • Bachelor’s degree in electrical engineering or related field.
  • 2.5–5 years of signal integrity and/or PCB design experience.
  • Proficiency in Xpedition, Altium Designer or Cadence Allegro.
  • Experience with multi-layer high-speed digital, analog, mixed-signal layouts.

Responsibilities

  • Optimize mixed signal PCB designs for signal integrity and reliability.
  • Design and layout high-density multi-layer PCBs.
  • Perform signal integrity analysis and simulations.
  • Collaborate with design and process engineers to optimize layouts.
  • Create and maintain design outputs (Gerber, CAD files, BOMs).
  • Stay updated with advancements in SI and PCB design technologies.

Skills

Signal Integrity
PCB Design
Teamwork
Communication
Project management

Education

Bachelor’s degree in electrical engineering

Tools

Xpedition
Altium Designer
Cadence Allegro
HFSS

Job description

Microchip Technology Inc. in Mount Holly Springs, PA, is seeking a skilled Signal Integrity PCB Design Engineer to drive high-density, multi-layer PCB designs with a focus on signal integrity, manufacturability, and reliability.

The ideal candidate has a strong background in SI and PCB layout and will contribute to cutting-edge timing solutions for diverse industries. This on-site role reports to the Mount Holly Springs facility, involves collaboration with design and process engineers, and

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