Signal Integrity Engineer – High‑Speed PCB & Packaging

Tenstorrent; California (MO); Hybrid; USD 100,000 - 500,000; Full time

Benefits offered by this job

Competitive compensation package

Health benefits

Equal opportunity employer

Job summary

A leading technology company is seeking a Signal Integrity Engineer to design and simulate high-speed interconnects. This hybrid role requires a Bachelor’s in Electrical Engineering, with 5+ years of relevant experience in high-speed digital design. The ideal candidate must have strong signal integrity skills and be proficient in PCB design tools. Compensation ranges from $100k to $500k based on experience and location. Join a collaborative team that's shaping the future of AI technology.

Qualifications

• 5+ years working in high-speed digital design with a focus on high-speed PCB or package design at 10Gbps and above.
• Comfortable with high-speed performance metrics such as ICR, ERL, COM, NEXT, and FEXT.
• Proficient with PCB ECAD tools.

Responsibilities

• Design, extract, and simulate complex breakout structures.
• Contribute to design and sign-off with internal and external ASIC packaging teams.
• Actively participate in design reviews.
• Support post-silicon bring-up and troubleshoot production failures.

Skills

High-speed digital design

Signal integrity

Collaboration

Electrical engineering knowledge

PCB design

Education

Bachelor’s degree in Electrical Engineering

Tools

Cadence Allegro

Job description

A leading technology company is seeking a Signal Integrity Engineer to design and simulate high-speed interconnects. This hybrid role requires a Bachelor’s in Electrical Engineering, with 5+ years of relevant experience in high-speed digital design. The ideal candidate must have strong signal integrity skills and be proficient in PCB design tools. Compensation ranges from $100k to $500k based on experience and location. Join a collaborative team that's shaping the future of AI technology.