Signal Integrity Engineer — High-Speed Interconnects & Lab Expert

Molex; Rochester Hills (MI); Vor Ort; USD 85.000 - 125.000; Vollzeit

Benefits dieser Stelle

Medical, Dental, Vision provided

401(k) with company match

Paid vacation/time off

Education assistance

Zusammenfassung

Molex is seeking an Signal Integrity Engineer (Entry to Senior level) to join the CMS Networking team. You will work at the intersection of mechanical design and electrical performance, developing next‑generation interconnects for automotive and data center environments.

You will leverage 3D EM tools, HFSS or CST, and lab equipment (VNA, TDR) to ensure optimal signal integrity across channels. The role involves 3D modeling, S-parameter extraction,optimization of pin-mair patterns, and

Qualifikationen

• Experience in high-frequency signal integrity and EM concepts.
• Ability to translate EM concepts into design guidance for mechanics.
• Exposure to 3D EM tools and lab measurement setups.

Aufgaben

• Perform 3D EM modeling and full-wave simulations of connectors and terminations.
• Extract S-parameters and identify impedance discontinuities.
• Optimize geometry to improve return loss and reduce crosstalk.
• Use VNA/TDR to characterize prototypes up to 20 GHz+.
• Document comparisons between tests and simulations for refinement.

Kenntnisse

3D EM Simulation

S-parameter analysis

Circuit/topology optimization

Cross-functional collaboration

Ausbildung

MS/PhD in EE or Physics

Tools

Ansys HFSS

CST Studio Suite

ADS Cadence Sigrity

VNA/TDR measurements

Jobbeschreibung

Molex is seeking an Signal Integrity Engineer (Entry to Senior level) to join the CMS Networking team. You will work at the intersection of mechanical design and electrical performance, developing next‑generation interconnects for automotive and data center environments.

You will leverage 3D EM tools, HFSS or CST, and lab equipment (VNA, TDR) to ensure optimal signal integrity across channels. The role involves 3D modeling, S-parameter extraction,optimization of pin-mair patterns, and