Signal Integrity Engineer: High-Speed Interconnects

Flint Hills Resources; Rochester Hills (MI); On-site; USD 90,000 - 140,000; Full time

Benefits offered by this job

Medical

Dental

Vision

Paid vacation/time off

Educational assistance

Retirement

Job summary

Molex is seeking a Signal Integrity Engineer (entry to senior level) to bridge mechanical design and electrical performance for automotive and data center interconnects. You will use 3D EM tools and lab equipment to ensure SI across connectors, cables, and terminations, working with cross-functional teams to optimize crosstalk and impedance.

Responsibilities include full-wave modeling, virtual prototyping, de-embedding, multi-port measurements, and data automation.

Qualifications

• Pursuing MS or PhD in EE or Physics with electromagnetics focus.
• 2–5 years with MS or 1–3 years with PhD in relevant fields.
• Strong desire to understand signal degradation and EM concepts.

Responsibilities

• Perform 3D EM simulations and modeling of interconnects.
• Create high-fidelity 3D models using HFSS or CST.
• Run S-parameter extractions and impedance analyses.
• Optimize designs to improve return loss and crosstalk.
• Use VNA/TDR for high-frequency testing up to 20 GHz+.
• De-embed fixtures and compare measurements to simulations.
• Develop scripts to automate data processing (Python/MATLAB).
• Collaborate with Mechanical Eng to align electrical performance with design.

Skills

3D EM Simulation

S-parameter analysis

Coaxial/PCB signal integrity

Python

MATLAB

Education

MS in Electrical Engineering or Physics

PhD in Electrical Engineering or Physics

Tools

Ansys HFSS

CST Studio Suite

Cadence Sigrity

ADS

Python

MATLAB

Oscilloscopes

Vector Network Analyzers (VNA)

Job description

Molex is seeking a Signal Integrity Engineer (entry to senior level) to bridge mechanical design and electrical performance for automotive and data center interconnects. You will use 3D EM tools and lab equipment to ensure SI across connectors, cables, and terminations, working with cross-functional teams to optimize crosstalk and impedance.

Responsibilities include full-wave modeling, virtual prototyping, de-embedding, multi-port measurements, and data automation.