SiC Advanced Packaging Applications Engineer

Wolfspeed; Durham (NC); On-site; USD 110,000 - 150,000; Full time

Job summary

Wolfspeed in Durham, NC seeks an Applications Engineer for Advanced Packaging to provide pre- and post-sales technical support for customers integrating Wolfspeed SiC substrates into 2.5D/3D packaging for HPC and AI data centers.

You will bridge materials expertise with customer package design, guide use-case selection, perform thermal modeling, and contribute to new SiC applications with foundries, OSATs, and hyperscalers.

Qualifications

• Bachelor's degree in Electrical Engineering or Materials Science or equivalent with relevant experience.
• Deep industry know-how on hyperscalers, foundries and OSATs and their requirements.
• Experience with 2.5D/3D packaging, interposers, and chiplet design.

Responsibilities

• Guide packaging engineers, foundries, and OSATs in selecting SiC use cases for advanced packaging.
• Provide remote and on-site technical support for Wolfspeed SiC substrates.
• Identify and propose new SiC use cases and co-design with partners.
• Lead design and documentation of reference demos for SiC interposer, heat-spreader, and substrate apps.
• Provide validated SiC material characteristics for accurate thermal modeling.
• Develop technical materials for conferences and ecosystem workshops.
• Support product/PDK launches and train sales and partners.

Skills

Thermal simulations

Packaging design

2.5D/3D integration

Industry know-how

Technical communication

Education

Bachelor's degree in Electrical Engineering or Materials Science

Tools

ANSYS Icepak

FloTHERM

Cadence Sigrity

Synopsys

Job description

Wolfspeed in Durham, NC seeks an Applications Engineer for Advanced Packaging to provide pre- and post-sales technical support for customers integrating Wolfspeed SiC substrates into 2.5D/3D packaging for HPC and AI data centers.

You will bridge materials expertise with customer package design, guide use-case selection, perform thermal modeling, and contribute to new SiC applications with foundries, OSATs, and hyperscalers.