SiC Advanced Packaging Applications Engineer (2.5D/3D HPC)

Whatsupstateny; United States; Remote; USD 120,000 - 170,000; Full time

Job summary

Whatsupstateny is seeking an Applications Engineer for Advanced Packaging to provide pre- and post-sales technical support for integrating Wolfspeed SiC substrates into 2.5D/3D HPC and AI data-center packaging. You will bridge materials expertise with customer designs, guiding use-case identification, material selection, and design validation.

The ideal candidate has a strong background in semiconductor packaging, thermal simulation, and process integration, with excellent communication skills

Qualifications

• Bachelor's degree in EE, Materials Science, or equivalent.
• Deep industry know-how on hyperscalers, foundries, OSATs.
• Experience with 2.5D/3D packaging architectures.
• Experience with package-level thermal analysis and simulations.
• Excellent written and oral communication.

Responsibilities

• Guide customer packaging teams in selecting optimal SiC use cases and integration strategies.
• Identify and propose new SiC use cases and co-design packaging architectures with partners.
• Lead reference demonstrations for SiC interposer, heat-spreader, and substrates with thermal benchmarks.
• Provide validated SiC material data for accurate package-level thermal modeling.
• Develop technical materials and present at industry events and partner workshops.
• Support product launches and train sales, foundry partners, and EDA ecosystem on SiC design rules.
• Translate customer requirements into new SiC packaging products and PDK enhancements.

Skills

Thermal management expertise

Packaging know-how

Strong communication

Cross-functional collaboration

Education

Bachelor's Degree in Electrical Engineering, Materials Science, or equivalent

Tools

ANSYS Icepak

FloTHERM

Cadence Sigrity

Synopsys

Job description

Whatsupstateny is seeking an Applications Engineer for Advanced Packaging to provide pre- and post-sales technical support for integrating Wolfspeed SiC substrates into 2.5D/3D HPC and AI data-center packaging. You will bridge materials expertise with customer designs, guiding use-case identification, material selection, and design validation.

The ideal candidate has a strong background in semiconductor packaging, thermal simulation, and process integration, with excellent communication skills