SiC Packaging Applications Engineer for AI/HPC Data Centers

Wolfspeed; Durham (NC); On-site; USD 110,000 - 160,000; Full time

Job summary

Wolfspeed is seeking an Applications Engineer for Advanced Packaging in Durham, NC. The role focuses on supporting customers integrating SiC substrates into 2.5D/3D packaging for HPC and AI data centers.

You will bridge materials knowledge with customer designs, guide use-case selection, and contribute to reference demos with thermal performance benchmarking. Responsibilities include remote/on-site support, co-design with foundries and OSATs, and presenting technical material at industry events.

Qualifications

• Bachelor's degree in Electrical Engineering, Materials Science, or equivalent.
• Experience with thermal simulation tools for package-level analysis.
• Understanding of advanced packaging architectures including 2.5D/3D integration.
• Strong communication and presentation skills.
• Experience with EDA/simulation environments related to packaging is a plus.

Responsibilities

• Guide customer packaging engineers, foundries, and OSATs in selecting optimal SiC use cases.
• Provide remote and on-site technical support.
• Lead design, development, and documentation of reference demonstrations for SiC interposer, heat-spreader, and substrate applications.
• Develop and present technical materials at packaging industry conferences.

Skills

Thermal simulation

2.5D/3D integration

Package design

Customer collaboration

Technical leadership

Education

Bachelor's degree in Electrical Engineering or Materials Science

Tools

ANSYS Icepak

FloTHERM

Cadence Sigrity

Synopsys tools

Job description

Wolfspeed is seeking an Applications Engineer for Advanced Packaging in Durham, NC. The role focuses on supporting customers integrating SiC substrates into 2.5D/3D packaging for HPC and AI data centers.

You will bridge materials knowledge with customer designs, guide use-case selection, and contribute to reference demos with thermal performance benchmarking. Responsibilities include remote/on-site support, co-design with foundries and OSATs, and presenting technical material at industry events.