SI/PI Tech Project Manager

Broadcom; San Jose (CA); On-site; USD 150,000 - 210,000; Full time

Benefits offered by this job

Discretionary annual bonus

Equity awards

Medical/dental/vision plans

Job summary

Broadcom, Inc. is seeking an experienced SI/PI technical project manager to support engineers in designing complex flip-chip-BGA packages, PCBs, and system channel links for high-speed SerDes, AI, HPC, and 5G applications.

The role collaborates with a worldwide R&D team to develop methodologies and flows for SI/PI. You will manage 20+ concurrent designs, coordinate cross-functional teams across time zones, and drive technical execution from planning through delivery, including lab validation and

Qualifications

• Experience managing people and projects in SI/PI domains.
• Strong knowledge of package, PCB and system-level SI/PI.
• Ability to lead cross-functional teams across time zones.

Responsibilities

• Navigate 20+ concurrent pkg/PCB designs with schedules and resources.
• Organize team and customer activities to keep projects on track.
• Communicate status, risks, and next steps clearly and concisely.
• Develop SI/PI methodologies and flows for packaging.

Skills

Project management

Signal integrity

Power integrity

Leadership

Communication

Education

BSEE or equivalent

MSEE or similar

PhD EE or similar

Tools

EDA tools

Lab equipment

Job description

Please Note:1. If you are a first time user, please create your candidate login account before you apply for a job.2. If you already have a Candidate Account, please Sign-In before you apply.Job Description:Location : Fort Collins or San JoseBroadcom is seeking an experienced SI/PI technical project manager to assist engineers designing complex flip-chip-BGA packages, PCBs, system channel links for industry-leading ASICs with high-speed SerDes and very-high-power-delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 448G, Optics, 5G RF/Microwave ADC/DAC, HBM, DDR and more. In this role, you will support and develop with the engineering team(s), as well as contribute to technical methodologies, flows and technical project management.RESPONSIBILITIES:Technical Project Management : Navigate and track project plans for 20+ concurrent pkg/PCB designs (scope, schedules, resources) from a technical execution standpointUnderstand the skill sets and traits of each team member, in order to maximize productivity and retentionOrganize team & customer activities to keep projects on trackClearly and concisely communicate plans, status, next steps and risks on a regular basisCreate technical methodologies for signal and power integrity solutionsUnderstanding and supporting package and PCB technologies with input from team membersCustomer, vendor, & cross-functional collaboration EDUCATION/EXPERIENCE & REQUIREMENTS:Preferred candidates have previous experience managing people and projectsBSEE or similar field and 12+ years or MSEE or similar field and 10+ years or PhD EE or similar field and 7+ years of work experience.Knowledge of package-level, PCB-level, and/or system level signal integrity and power integrity, to apply to package and PCB designs.Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designersSelf-management, organization, and clear communication skillsTechnical understanding related to System Signal and Power Integrity development and support :Project ManagementAutomation code developmentSI/PI EDA extractions and simulationsSystem level SerDes channel resultsLab measurements - passive and activeLab and measurement correlation effortsLab equipment needs and managementPackage and PCB lifecycle and design flowsHow the substrate and package fit into the overall system implementation and trade-offs therein to support customers effectivelyDesign Data, including how it is created and utilized (e.g. package:: .mcm, package spreadsheet, drawings (POD, Lid, Substrate))OTHER REQUIREMENTSThis job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position. This role is deeply collaborative and requires direct, real-time engagement with lab equipment and face-to-face team co-designCompensation and BenefitsThe annual base salary range for this position is USD To USDAs a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.