Senior TPM – Multi-Die Silicon Tape-Out Lead

Amazon; Cupertino (CA); On-site; USD 204,000 - 275,000; Full time

Benefits offered by this job

RSUs

Health insurance

401(k) matching

Job summary

Amazon Annapurna Labs ML Accelerator team in Cupertino, CA seeks a Principal Technical Program Manager to own end-to-end program execution for a multi-die chiplet ML accelerator from RTL freeze through tape-out and into production readiness.

You will connect a broad set of engineering workstreams, identify the critical path weekly, and drive cross-functional decisions to keep the program on track across RTL, DV, physical design, packaging, power, infrastructure, and IP partners.

Qualifications

• 10+ years managing complex technology projects.
• Experience with engineering teams and complex silicon lifecycles.
• Ability to build integrated schedules with dependency modeling.

Responsibilities

• Own the integrated schedule and critical path across multiple die tape-outs.
• Synthesize inputs from RTL/DV, physical design, packaging, power, infra, IP into one view.
• Track verification convergence and guide engineering response when issues arise.
• Manage external design partner interfaces and negotiate schedule trades.
• Drive infrastructure readiness and IP deliveries with capacity planning.

Skills

Program management

Engineering collaboration

Technical communication

Schedule development

Dependency modeling

Cross-functional leadership

Job description

Amazon Annapurna Labs ML Accelerator team in Cupertino, CA seeks a Principal Technical Program Manager to own end-to-end program execution for a multi-die chiplet ML accelerator from RTL freeze through tape-out and into production readiness.

You will connect a broad set of engineering workstreams, identify the critical path weekly, and drive cross-functional decisions to keep the program on track across RTL, DV, physical design, packaging, power, infrastructure, and IP partners.