AI-First Hardware TPM — Lead Silicon Photonics Tapeout

Neurophos, Inc.; Austin, Northern (TX, KY); Hybrid; USD 180,000 - 260,000; Full time

Benefits offered by this job

Health plan coverage

HSA contributions

Unlimited PTO

401(k) matching

Stock options

Voluntary benefits

Personalized benefits

Job summary

Neurophos, Inc. is seeking a seasoned TPM to own the EIC program, spanning architecture through tapeout and production readiness in Austin. You will integrate RTL, DV, analog/mixed-signal, and packaging with a strong AI-assisted workflow.

You will lead cross-functional teams, partner with foundries and OSAT, and drive risk management and schedule discipline in a fast-moving startup. Ideal candidates bring deep silicon program experience and startup mindset.

Qualifications

• BS in Electrical/Computer Engineering or equivalent; MS preferred.
• 10+ years in ASIC/SoC development as a TPM/EPM on complex silicon programs.
• 2+ complete silicon programs from architecture to tapeout; at least one post-silicon bring-up.
• Fluent across the silicon lifecycle: architecture, front-end design, verification, physical design, reliability/qualification.
• Experience managing foundry, IP vendor, OSAT, and design-services relationships.

Responsibilities

• Drive end-to-end EIC program from architecture through tapeout and production readiness.
• Deploy AI/LLM tooling for spec, schedule tracking, risk management, and documentation.
• Converge EIC specification with architecture; drive reviews and change control.
• Coordinate RTL, DV, analog/mixed-signal, DFT, physical design, and external partners.
• Adopt AI-assisted design, verification, and debug flows where they save time.
• Build tapeout readiness checklists and manage tapeout decisions.
• Manage foundry engagement, schedules, and wafer starts.
• Drive post-tapeout bring-up and OSAT coordination.
• Track cross-domain dependencies and surface risks early.
• Run program rhythm with cross-functional syncs and phase-gate reviews.

Skills

Program management

Cross-functional leadership

Jira tooling

AI tooling

Technical depth

Education

BS in Electrical/Computer Engineering

MS preferred

Tools

Jira

EDA tools

FPGA emulation

Job description

Neurophos, Inc. is seeking a seasoned TPM to own the EIC program, spanning architecture through tapeout and production readiness in Austin. You will integrate RTL, DV, analog/mixed-signal, and packaging with a strong AI-assisted workflow.

You will lead cross-functional teams, partner with foundries and OSAT, and drive risk management and schedule discipline in a fast-moving startup. Ideal candidates bring deep silicon program experience and startup mindset.