Senior TIM Engineer - Customer-Facing Thermal Solutions

Boston Materials; Billerica (MA); On-site; USD 120,000 - 170,000; Full time

Benefits offered by this job

Health, Vision & Dental coverage

401(k) plan

4 weeks Paid Parental and Family Leave

Unlimited Paid Time Off

14 holidays per year

Job summary

A leading advanced materials company in Massachusetts is seeking a Senior Materials Engineer to be the key technical partner for customers evaluating high-performance thermal interface materials. The ideal candidate will have a strong background in semiconductor packaging and mechanical engineering, with 3–7 years of relevant experience. Responsibilities include leading development efforts, managing customer interactions, and ensuring the successful integration of products into electronic packages, all while contributing to innovative solutions in thermal management.

Qualifications

• 3–7 years of experience in semiconductor packaging or applications engineering.
• Strong understanding of system-level processor packaging and reliability testing.
• Proven ability to lead cross-functional technical efforts.

Responsibilities

• Lead development efforts to integrate thermal interface materials.
• Document designs for fabrication and customer coordination.
• Prepare technical content to support customer qualification processes.

Skills

CAD modeling and drafting

mechanical and thermal testing

data analysis

excellent communication skills

Education

Bachelor’s or Master’s degree in Mechanical Engineering

Tools

thermal test setups

FEA modeling

Job description

A leading advanced materials company in Massachusetts is seeking a Senior Materials Engineer to be the key technical partner for customers evaluating high-performance thermal interface materials. The ideal candidate will have a strong background in semiconductor packaging and mechanical engineering, with 3–7 years of relevant experience. Responsibilities include leading development efforts, managing customer interactions, and ensuring the successful integration of products into electronic packages, all while contributing to innovative solutions in thermal management.