Senior TIM Integration Engineer for AI/HPC Packaging

Front Door Defense; Billerica (MA); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Health, Vision & Dental coverage (emcl

Job summary

Boston Materials in Billerica, MA is seeking a Senior Mechanical Engineer to lead Thermal Interface Material (TIM) integration from requirements through qualification for AI/HPC packaging. You will act as the primary technical partner to customers, translating needs into tests, samples, and validated data while coordinating with ODMs, OSATs, and hyperscalers.

The role emphasizes customer collaboration, problem solving, and robust product performance validation, with 10–20% travel.

Qualifications

• Bachelor's or Master's in Mechanical Engineering, Materials Science, Electrical Engineering, or related field.
• Experience in semiconductor packaging, electronics assembly, or TIM applications.
• Strong ability to communicate technical topics to engineers and non-technical stakeholders.

Responsibilities

• Lead internal design and development to integrate TIM into customer packages.
• Build and test package mockups and perform mechanical and reliability testing.
• Document designs for fabrication and customer coordination; support internal/external fabrication.
• Collaborate with R&D to improve system performance and reliability.
• Serve as primary technical contact for ODM/OSAT and hyperscalers during early engagement.
• Capture customer requirements and translate into actionable technical work.
• Prepare application notes, design guides, and data reports for decision-making.

Skills

CAD modeling

data analysis

thermal testing

prototyping

communication

cross-functional leadership

travel 10-20%

Education

Bachelor's degree in Mechanical Engineering

Master's degree in Materials Science or related

related field

Tools

X-ray

FEA modeling

thermal test setups

C-SAM

Job description

Boston Materials in Billerica, MA is seeking a Senior Mechanical Engineer to lead Thermal Interface Material (TIM) integration from requirements through qualification for AI/HPC packaging. You will act as the primary technical partner to customers, translating needs into tests, samples, and validated data while coordinating with ODMs, OSATs, and hyperscalers.

The role emphasizes customer collaboration, problem solving, and robust product performance validation, with 10–20% travel.