Thermal Systems Integration Engineer, Advanced Packaging

Boston Materials; Billerica (MA); On-site; USD 120,000 - 170,000; Full time

Job summary

Boston Materials is seeking a highly motivated Applications Engineer to serve as the primary technical partner for customers evaluating our high-performance thermal interface material (TIM). You will lead early- to mid-stage customer interactions, translating requirements into actionable technical work and ensuring data, samples, and support for successful integration.

This role offers close collaboration with hyperscalers, ODMs, and OSATs to influence adoption of cutting-edge thermal solutions

Qualifications

• Role focuses on customer engagement and technical validation of TIM.
• Experience translating customer requirements into technical work.
• Ability to lead early- to mid-stage customer interactions.

Responsibilities

• Serve as primary technical partner for customers evaluating TIM.
• Lead customer interactions from requirements to data and samples.
• Support integration and qualification of TIM in semiconductor packaging.

Skills

Customer engagement

Problem solving

Technical communication

Data-driven decisions

Job description

Boston Materials produces advanced materials with enhanced energy transfer properties using its patented Z-axis Carbon Fiber technology. The Company's products solve critical performance bottlenecks in applications spanning thermal, electrical, and structural use cases. Its breakthrough Liquid Metal ZRT thermal interface material is designed for the most demanding AI Infrastructure. Boston Materials is committed to expanding high-volume manufacturing in the United States. For more information, visit https://www.bomaterials.com/

ABOUT THE OPPORTUNITY

Not often in one's career do we get the chance to—

Get close to the mission.

Getting a real sense of what the business does and how our work directly affects the outcome. Where everyone is involved with the company's success. No layers, no silos, no bureaucracy. Just the opportunity to make the greatest impact with the most responsibility.

Move faster.

Adapting to changes in the market at record speed. No multi-layer signoffs and approvals. Instead, the latitude needed to get a new idea, product, or process off the ground quickly. Where we can experiment and test new ideas— and are encouraged to do so. We create solutions to problems that our customers truly care about, and we understand that customers won't wait for us to figure them out.

Branch beyond the role.

We're not defined by past experiences or confined by our current job description. Every day offers opportunities to have influence and be challenged with new projects and tasks. Working shoulder-to-shoulder with some of the top talent in the industry, we're able to showcase our talents, expand our knowledge, develop new skills, and take ownership and act. All while contributing to the overall success of the organization.

Create critical solutions.

Join us to solve the most critical challenges facing the Advanced Semiconductor, AI Infrastructure, and Advanced Materials industries.

Opportunity knocks at Boston Materials. Will you answer the call?

The Role

We are seeking a highly motivated Applications Engineer to serve as the primary technical partner for our customers as they evaluate and adopt our high-performance thermal interface material (TIM) products. This role is ideal for an engineer who thrives at the intersection of customer engagement, problem-solving, and product performance validation. You will be responsible for leading early- to mid-stage customer interactions, capturing and translating requirements into actionable technical work, and ensuring that customers have the data, samples, and support they need to successfully integrate and qualify our TIM in their advanced semiconductor packaging applications. This position offers the opportunity to work closely with hyperscalers, ODMs, and OSATs, and to influence the adoption of cutting-edge thermal solutions in next-generation AI and data center systems.

Join us to solve one of the most critical challenges facing the Semiconductor and Electronics Industry - thermal management!

Job posting details for Thermal Systems Integration Engineer, Advanced Packaging at Boston Materials in Billerica, MA. Compensation / salary range: 120,000 - 170,000 USD, yearly. ClimateTechList gathers 9,000+ job openings from over 509 climate tech companies and updates them daily.