Dielectric Thin‑Film Process Development Engineer

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 90,000 - 130,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid family leave

Robust paid time‑off program

Paid holidays

Job summary

Micron Technology, Inc. is seeking a Process Development Engineer focused on dielectric deposition to own key processes and influence technical direction.

You will collaborate with integration, equipment, and operations to deliver robust, scalable solutions meeting aggressive performance and yield goals. The role requires a Master’s or PhD in a related field, hands-on thin‑film deposition experience, and data-driven problem solving using DOE/SPC.

Qualifications

• Master's degree with 2+ years in physics, chemistry, chemical engineering, materials science, or related field, or PhD with relevant experience.
• Hands-on experience with thin-film deposition and process troubleshooting.
• Working knowledge of ALD, epitaxy, or plasma-based deposition fundamentals.
• Experience using data-driven methods such as DOE, SPC, and basic materials characterization.
• Ability to work independently and clearly communicate technical results.

Responsibilities

• Drive project roadmaps and manage development and maturity timelines.
• Lead meaningful thin-film improvements within the hardware‑process space.
• Communicate status and plans to leadership with focus on technical fundamentals and model-based problem solving.
• Regularly interact with and lead cross-functional teams to influence technical and strategic decisions; build relationships with suppliers.
• Ensure projects meet technical and operational KPIs and deliver robust, scalable deposition solutions.

Skills

ALD deposition

Thin-film deposition

Epitaxy

Data-driven methods

Cross-functional teamwork

Education

Master’s degree or PhD in Physics/Chemistry/CE/Materials Science

Job description

Micron Technology, Inc. is seeking a Process Development Engineer focused on dielectric deposition to own key processes and influence technical direction.

You will collaborate with integration, equipment, and operations to deliver robust, scalable solutions meeting aggressive performance and yield goals. The role requires a Master’s or PhD in a related field, hands-on thin‑film deposition experience, and data-driven problem solving using DOE/SPC.