Senior Staff Engineer, Thermal Simulation

Samsung-Semiconductor; San Jose (CA); On-site; USD 189,000 - 301,000; Full time

Benefits offered by this job

4+ weeks paid time off

Fertility/adoption stipend

Medical travel support

Onsite cafe & gym

Flexible work environment

Job summary

Samsung Semiconductor seeks a Senior Staff Engineer to lead thermal simulation for advanced packaging. The role focuses on hands-on modeling, multi-physics analysis, and collaboration with cross-functional teams in a fast-paced environment in San Jose, CA. Experience with IC/chip/package thermal constraints and SIP would be ideal.

The position requires a PhD with 10+ years in industry, strong CFD tool proficiency, and excellent communication to guide design decisions and customer engagements.

Qualifications

• PhD in Mechanical Engineering, Thermal/Fluids, or related field with 10+ years of industry experience.
• Experience using CFD tools (e.g., ANSYS Icepak, Flotherm, CELSIUS) to build models and troubleshoot packaging issues.
• Strong understanding of heat transfer, fluid mechanics, thermal management, and electronics cooling fundamentals.
• Knowledge of SiP thermal analysis and IC chip/package architectures is a plus.
• Excellent communication and collaboration skills, with cross-cultural teamwork experience.

Responsibilities

• Lead hands-on thermal modeling and analysis for semiconductor packages and advanced packaging.
• Build and analyze detailed models with CAD/CFD tools, set up boundaries, run simulations, and post-process results.
• Influence architecture, materials selection, and structural integrity under manufacturing and testing conditions.
• Analyze simulation data to improve product reliability and guide design decisions.
• Support customers from early thermal architecture studies to detailed modeling and optimization.
• Translate customer requirements into robust simulation methodologies and validation plans.
• Develop best practices and innovative solutions for semiconductor and packaging applications.
• Communicate findings through reports, presentations, and customer reviews.
• Stay abreast of advances in advanced packaging, 2.5D/3D integrations, and high-power cooling.

Skills

Thermal modeling

CFD analysis

Electronics cooling fundamentals

Packaging architectures understanding

Cross-functional collaboration

Education

PhD in Mechanical Engineering, Thermal/Fluids, or related Physical Science

Tools

ANSYS Icepak

Siemens Flotherm

CELSIUS

Job description

Senior Staff Engineer, Thermal Simulation

San Jose, California, United States

Please Note

To provide the best candidate experience amidst our high application volumes, each candidate is limited to 10 applications across all open jobs within a 6-month period.

Advancing the World’s Technology Together

Our technology solutions power the tools you use every day--including smartphones, electric vehicles, hyperscale data centers, IoT devices, and so much more. Here, you’ll have an opportunity to be part of a global leader whose innovative designs are pushing the boundaries of what’s possible and powering the future.

We believe innovation and growth are driven by an inclusive culture and a diverse workforce. We’re dedicated to empowering people to be their true selves. Together, we’re building a better tomorrow for our employees, customers, partners, and communities.

We are seeking a highly experience hands‑on Senior Staff Thermal Engineer to lead thermal modeling, analysis, and solution development for semiconductors and advanced packaging technologies. The ideal candidate will have a strong technical background in semiconductor packaging, advanced packaging, electronics cooling, or a related field, with demonstrated expertise in thermal simulation and analysis.

This role will work closely with Samsung customers and internal engineering customers and internal engineering teams to develop and optimize thermal solutions from early product through detailed modeling and design validation.

The successful candidate will collaborate extensively with cross functional and cross-cultural teams.

Location: Daily onsite presence at our San Jose headquarters in alignment with our Flexible Work policy with 10-20% of domestic and international travel.

Reports to: Thermal/Mechanical Simulation Manager

What You’ll Do

• Lead and perform hands‑on thermal modeling and analysis for semiconductor packages, advanced packaging, and electronic systems.
• Build and analyze detailed models using ANSYS Icepak and Siemens Flotherm, including model setup, boundary conditions, solver execution and post‑processing.
• Influence the architecture and/or design, materials selection, and structural integrity of the high‑performance advanced packaging, and other associated components and collaterals under manufacturing, test, and usage conditions.
• Analyze simulation and measurement results to enhance product reliability.
• Support Samsung customers throughout the product development cycle, from early thermal architecture and feasibility studies to detailed modeling, optimizations, and design recommendations.
• Translate customer requirements and thermal specifications into simulation methodologies.
• Develop best known standards and methodologies and create innovative solutions for challenging semiconductor and packaging applications.
• Communicate technical findings clearly through engineering reports, presentations and customer reviews.
• Stay current with emerging technologies in advanced packaging, HBM, 2.5D/3D integrations, high power computing, and electronics cooling.

What You Bring

• PhD in Mechanical Engineering, Thermal/Fluids, or related Physical Science with 10+ years of Industry Experience is preferred.
• Experience in the use of CFD tools such as ANSYS Icepak, Flotherm, CELSIUS and analyzing, debugging, and proposing solutions to resolve various electronic packaging issues observed during assembly, reliability and operation. Ability to independently build models, perform analysis, troubleshoot results and develop engineering recommendations.
• Strong understanding of heat transfer, fluid mechanics, thermal management, and electronics cooling fundamentals.
• Fundamental understanding of IC chip/package architectures and thermal design constraints.
• Working experience in SiP (System in Package)thermal analysis.
• Excellent communication and collaboration skills with demonstrated ability to work effectively in cross functional and cross cultural teams.
• You’re inclusive, adapting your style to the situation and diverse global norms of our people.
• An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.
• You’re collaborative, building relationships, humbly offering support and openly welcoming approaches.
• Innovative and creative, you proactively explore new ideas and adapt quickly to change.

#LI-MD1

What We Offer

• Base Pay Range
• $189,000 - $301,000 USD
• The pay range below is for all roles at this level across all US locations and functions. Paywithin this range varies by work locationand may also depend on job-related knowledge, skills,and experience. We also offer incentive opportunities that reward employees based on individual and company performance.
• This is in addition to our diverse package of benefits centered around the wellbeing of our employees and their loved ones. In addition to the usual Medical/Dental/Vision/401k, our inclusive rewards plan empowers our people to care for their whole selves. An investment in your future is an investment in ours.
• Give Back: With a charitable giving match and frequent opportunities to get involved, we take an active role in supporting the community.
• Enjoy Time Away: You’ll start with 4+ weeks of paid time off a year, plus holidays and sick leave, to rest and recharge.
• Care for Family: Whatever family means to you, we want to support you along the way—including a stipend for fertility care or adoption, medical travel support, and virtual vet care for your fur babies.
• Prioritize Emotional Wellness: With on-demand apps and free confidential therapy sessions, you’ll have support no matter where you are.
• Stay Fit: Eating well and being active are important parts of a healthy life. Our onsite Café and gym, plus virtual classes, make it easier.
• Embrace Flexibility: Benefits are best when you have the space to use them. That’s why we facilitate a flexible environment so you can find the right balance for you.

Equal Opportunity Employment Policy

Samsung Semiconductor takes pride in being an equal opportunity workplace dedicated to fostering an environment where all individuals feel valued and empowered to excel, regardless of race, religion, color, age, disability, sex, gender identity, sexual orientation, ancestry, genetic information, marital status, national origin, political affiliation, or veteran status.

When selecting team members, we prioritize talent and qualities such as humility, kindness, and dedication. We extend comprehensive accommodations throughout our recruiting processes for candidates with disabilities, long-term conditions, neurodivergent individuals, or those requiring pregnancy-related support. All candidates scheduled for an interview will receive guidance on requesting accommodations.

Our Commitment to Innovation and Fairness

At Samsung Semiconductor, we use Artificial Intelligence (AI) tools in the recruitment process to enhance efficiency. However, AI is used as a support tool, not a final decision-maker. All hiring decisions are made by our human recruiting team and hiring managers to ensure every candidate is evaluated fairly and holistically.

Voluntary Self-Identification

For government reporting purposes, we ask candidates to respond to the below self-identification survey.Completion of the form is entirely voluntary. Whatever your decision, it will not be considered in the hiringprocess or thereafter. Any information that you do provide will be recorded and maintained in aconfidential file.

As set forth in Samsung Semiconductor’s Equal Employment Opportunity policy,we do not discriminate on the basis of any protected group status under any applicable law.

If you believe you belong to any of the categories of protected veterans listed below, please indicate by making the appropriate selection.As a government contractor subject to the Vietnam Era Veterans Readjustment Assistance Act (VEVRAA), we request this information in order to measurethe effectiveness of the outreach and positive recruitment efforts we undertake pursuant to VEVRAA. Classification of protected categoriesis as follows:

A "disabled veteran" is one of the following: a veteran of the U.S. military, ground, naval or air service who is entitled to compensation (or who but for the receipt of military retired pay would be entitled to compensation) under laws administered by the Secretary of Veterans Affairs; or a person who was discharged or released from active duty because of a service-connected disability.

A "recently separated veteran" means any veteran during the three-year period beginning on the date of such veteran's discharge or release from active duty in the U.S. military, ground, naval, or air service.

An "active duty wartime or campaign badge veteran" means a veteran who served on active duty in the U.S. military, ground, naval or air service during a war, or in a campaign or expedition for which a campaign badge has been authorized under the laws administered by the Department of Defense.

An "Armed forces service medal veteran" means a veteran who, while serving on active duty in the U.S. military, ground, naval or air service, participated in a United States military operation for which an Armed Forces service medal was awarded pursuant to Executive Order 12985.

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The application deadline for this role is December 31, 2026