Senior Thermal & Multiphysics Architect

TE Connectivity

United States

On-site

USD 154,000 - 231,000

Full time

5 days ago

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Job summary

TE Connectivity seeks a Principal Thermal & Multiphysics Engineer to lead advanced thermal research and predictive analysis for interconnect systems in AI data centers, HPC, and next‑gen communications infrastructure.

You will drive multiphysics simulations, validate materials, and collaborate across mechanical, electrical, and manufacturing teams to enhance performance, reliability, and manufacturability with high autonomy.

Qualifications

Bachelor’s degree in Mechanical Engineering or Physics with 12+ years of experience, or Master’s with 10+ years, or PhD with 6+ years, or equivalent experience in mechanical product development in connector, electronics, or high-reliability hardware industries.
Hands-on experience with mechanical design and modeling using Creo, SolidWorks, or NX.
Expertise in simulation tools such as ANSYS, Abaqus, or FloTHERM for thermal/structural analysis.
Proven experience in DFM, DFA, and transition of mechanical designs to high-volume manufacturing.
Deep understanding of materials science, including polymers, metals, and thermal materials.
Experience conducting reliability testing: thermal cycling, vibration, drop/shock, and HALT/HASS.
Strong problem-solving and analytical skills with a focus on root cause analysis and continuous improvement.
Excellent communication skills to engage with global engineering, operations, and customer teams

Responsibilities

Lead end-to-end multiphysics simulation strategy and method development for thermal performance of complex electro-mechanical systems (connectors, high-speed I/O, enclosures, power-dense assemblies).
Support thermal architecture development, defining heat transfer strategies across conduction, convection, and radiation to meet system-level performance targets.
Translate system-level thermal challenges into physics-based models using FEA/CFD to solve electro-thermal, thermo-mechanical, and fluid-thermal problems under real-world conditions.
Drive thermal design optimization for high-power-density systems, balancing temperature, pressure drop, signal integrity, and manufacturability.
Establish thermal design standards and best practices, including thermal resistance networks, contact/interface heat transfer, airflow and liquid cooling integration, and thermal distortion/tolerance stack-up effects.
Mentor engineers and build domain expertise in thermal sciences, multiphysics simulation, and physics-based design.
Represent the organization externally with customers, industry forums, and standards bodies on advanced thermal challenges.