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TE Connectivity Corporation seeks a Principal Thermal & Multiphysics Engineer to lead advanced thermal research, simulations, and validation for high-performance interconnect systems used in AI data centers and data communications. You will guide cross-functional teams and mentor engineers while shaping thermal design strategies from PoCs to NPI handoff.
The role emphasizes developing robust cooling solutions, validating materials, and ensuring reliability, manufacturability, and scalability
TE Connectivity Corporation seeks a Principal Thermal & Multiphysics Engineer to lead advanced thermal research, simulations, and validation for high-performance interconnect systems used in AI data centers and data communications. You will guide cross-functional teams and mentor engineers while shaping thermal design strategies from PoCs to NPI handoff.
The role emphasizes developing robust cooling solutions, validating materials, and ensuring reliability, manufacturability, and scalability