Senior Tech Leader, Advanced Packaging & Deposition

Intel Corporation; Albuquerque, Northern (NM, KY); Hybrid; USD 164.000 - 232.000; Vollzeit

Benefits dieser Stelle

Stock bonuses

Health benefits

Retirement plan

Vacation

Zusammenfassung

Intel Corporation is seeking a Senior Technical Leader for its Advanced Packaging group in Albuquerque, NM. You will drive process innovation across CVD, ALD, and PVD thin-film deposition, enabling high-volume manufacturing for EMIB, Foveros, and Silicon Photonics technologies.

You will lead cross-functional efforts with Technology Development, HVM, Product Engineering, and Supply Chain to deliver manufacturable, high-yield solutions while meeting cost and customer requirements.

Qualifikationen

• - Master's or Bachelor's in a STEM field with 8+ or 10+ years in semiconductor thin-film deposition.
• - Experience in process development, manufacturing engineering, and technical leadership roles.
• - Proven collaboration with leading semiconductor equipment suppliers on process and equipment optimization.

Aufgaben

• Champion safety, quality, yield, throughput, and cost optimization across thin-film deposition processes.
• Drive defect reduction and process capability improvements.
• Lead problem-solving efforts and deliver innovative solutions meeting aggressive node targets.
• Optimize equipment performance in partnership with stakeholders and equipment suppliers.
• Develop and implement robust process controls for manufacturing stability and scalability.
• Align technical strategies with customer requirements and product roadmaps.
• Own end-to-end resolution of manufacturing challenges across engineering disciplines.
• Mentor and develop technical talent and promote continuous improvement.

Kenntnisse

Thin-film deposition

Cross-functional leadership

Statistical process control

DOE (Design of Experiments)

Process optimization

Equipment collaboration

Ausbildung

Master's degree in Electrical/Mechanical/Chemical Engineering or Materials Science

Bachelor's degree in Electrical/Mechanical/Chemical Engineering or Materials Science

Ph.D. (Preferred) in related STEM field

Tools

AMAT

Lam Research

ASM

TEL

Jobbeschreibung

Intel Corporation is seeking a Senior Technical Leader for its Advanced Packaging group in Albuquerque, NM. You will drive process innovation across CVD, ALD, and PVD thin-film deposition, enabling high-volume manufacturing for EMIB, Foveros, and Silicon Photonics technologies.

You will lead cross-functional efforts with Technology Development, HVM, Product Engineering, and Supply Chain to deliver manufacturable, high-yield solutions while meeting cost and customer requirements.