Senior Substrate Process Engineer | Equity & Packaging

Blackbird Ventures Pty; Tempe (AZ); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Equity opportunities

401(k)

Health/dental/vision coverage

Professional growth

Team events

Work-life balance

PTO & sick leave

Job summary

Syenta is seeking a Senior Process Engineer (Substrate) to support the development of our advanced packaging toolset. You will develop PID coating and patterning processes, wafer-level processing including photolithography, etching, thin-film deposition, wet processing, and metrology verification, translating prototypes into scalable manufacturing solutions.

You will collaborate across substrate build-up, microfabrication, and characterization, contributing to next-generation device production

Qualifications

• Bachelor's degree in physics, chemistry, materials science, electrical engineering, mechanical engineering, or related field.
• Minimum 7 years of combined microfabrication experience with cleanroom proficiency.
• Hands-on experience with photoresist coating, exposure, and development tools and processes.
• Knowledge of PID materials for interposer buildup.
• Experience with etching processes (ICP, RIE, CCP, and wet etching).
• Experience in metallization and thin-film deposition (PECVD, PVD, etc.).
• Experience working in semiconductor-grade cleanroom environments.

Responsibilities

• Develop and optimize PID and light-sensitive insulating material processes for advanced packaging and fine-line circuit patterning.
• Drive multi-layer build-up process development and translate prototype processes into scalable, high-yield manufacturing solutions.
• Execute microfabrication processes including photolithography, etching, thin film deposition, wet processing, and metrology verification.
• Troubleshoot microfabrication defects.
• Collaborate with Sydney team and ensure documentation is clear and thorough.
• Work with materials scientists, chemists, and engineers to deliver prototypes and an integrated product.
• Support transfer of developed processes to national and international commercial fabs.
• Engage with external suppliers clearly, timely, and thoroughly.
• Perform metrology and inspection to assess process quality and reproducibility.
• Analyze experimental data and translate findings into process improvements.
• Basic reliability testing literacy in TCT, HAST, MSL.
• Explore new lithography and fabrication techniques to improve resolution and performance.
• Contribute to continuous improvement of fabrication workflows and process capability.

Skills

Photoresist coating

Exposure tools

Development processes

PID materials

Etching (ICP/RIE)

Metallization

Thin-film deposition

Cleanroom environments

Education

Bachelor's degree in physics, chemistry, materials science, electrical or mechanical engineering, or related field

Master's or PhD in related field

Tools

Photoresist coating equipment

Exposure equipment

Development tools

ICP etching equipment

RIE/CCP etching systems

PECVD deposition systems

PVD deposition systems

Cleanroom facilities

Job description

Syenta is seeking a Senior Process Engineer (Substrate) to support the development of our advanced packaging toolset. You will develop PID coating and patterning processes, wafer-level processing including photolithography, etching, thin-film deposition, wet processing, and metrology verification, translating prototypes into scalable manufacturing solutions.

You will collaborate across substrate build-up, microfabrication, and characterization, contributing to next-generation device production