Senior Process Engineer - Substrate

Blackbird Ventures Pty; Tempe (AZ); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Equity opportunities

401(k)

Health/dental/vision coverage

Professional growth

Team events

Work-life balance

PTO & sick leave

Job summary

Syenta is seeking a Senior Process Engineer (Substrate) to support the development of our advanced packaging toolset. You will develop PID coating and patterning processes, wafer-level processing including photolithography, etching, thin-film deposition, wet processing, and metrology verification, translating prototypes into scalable manufacturing solutions.

You will collaborate across substrate build-up, microfabrication, and characterization, contributing to next-generation device production

Qualifications

• Bachelor's degree in physics, chemistry, materials science, electrical engineering, mechanical engineering, or related field.
• Minimum 7 years of combined microfabrication experience with cleanroom proficiency.
• Hands-on experience with photoresist coating, exposure, and development tools and processes.
• Knowledge of PID materials for interposer buildup.
• Experience with etching processes (ICP, RIE, CCP, and wet etching).
• Experience in metallization and thin-film deposition (PECVD, PVD, etc.).
• Experience working in semiconductor-grade cleanroom environments.

Responsibilities

• Develop and optimize PID and light-sensitive insulating material processes for advanced packaging and fine-line circuit patterning.
• Drive multi-layer build-up process development and translate prototype processes into scalable, high-yield manufacturing solutions.
• Execute microfabrication processes including photolithography, etching, thin film deposition, wet processing, and metrology verification.
• Troubleshoot microfabrication defects.
• Collaborate with Sydney team and ensure documentation is clear and thorough.
• Work with materials scientists, chemists, and engineers to deliver prototypes and an integrated product.
• Support transfer of developed processes to national and international commercial fabs.
• Engage with external suppliers clearly, timely, and thoroughly.
• Perform metrology and inspection to assess process quality and reproducibility.
• Analyze experimental data and translate findings into process improvements.
• Basic reliability testing literacy in TCT, HAST, MSL.
• Explore new lithography and fabrication techniques to improve resolution and performance.
• Contribute to continuous improvement of fabrication workflows and process capability.

Skills

Photoresist coating

Exposure tools

Development processes

PID materials

Etching (ICP/RIE)

Metallization

Thin-film deposition

Cleanroom environments

Education

Bachelor's degree in physics, chemistry, materials science, electrical or mechanical engineering, or related field

Master's or PhD in related field

Tools

Photoresist coating equipment

Exposure equipment

Development tools

ICP etching equipment

RIE/CCP etching systems

PECVD deposition systems

PVD deposition systems

Cleanroom facilities

Job description

About Syenta

Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localized Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization into a single tool. We do that by achieving high-speed, high-resolution metallization at significantly lower costs and energy use, while minimizing emissions and waste.

Founded in Australia, our growing footprint in the US represents a key milestone in our journey. We are building a world-class team where seasoned engineers and ambitious emerging talent collaborate to solve some of the toughest challenges in semiconductor manufacturing.

About the Role

We are seeking a Senior Process Engineer (Substrate) to support the development of Syenta's advanced packaging toolset. In this hands-on role, you will develop critical components of the toolset, focusing on process development of (1) Photo Imageable Dielectric (PID) coating and patterning of precise, fine-line circuitry, and (2) Wafer Level Processing, including photolithography, etching, thin film deposition, wet processing, and metrology verification.

You will work across substrate build-up processes, general microfabrication, and characterization, contributing directly to the development of next-generation device production processes and helping translate prototypes into scalable manufacturing solutions.

Responsibilities

Process Development & Fabrication

• Develop and optimize Photo Imageable Dielectric (PID) and light-sensitive insulating material processes (e.g., PV-FX2 HR200) for advanced semiconductor packaging and fine-line circuit patterning


• Drive multi-layer build-up process development and support translation of prototype processes into scalable, high-yield manufacturing solutions for advanced packaging


• Execute microfabrication processes including photolithography, etching, thin film deposition, wet processing, and metrology verification (e.g., developing tool- and material-specific recipes)


• Troubleshoot microfabrication defects

Cross-Functional Collaboration

• Collaborate closely with Sydney team


• Ensure documentation is clear and thorough


• Work closely with materials scientists, chemists, and engineers to deliver prototypes and an integrated product


• Support transfer of developed processes to national and international commercial fabs


• Ensure clear, timely, and well-documented engagement with external suppliers

Characterization & Analysis

• Perform metrology and inspection to assess process quality and reproducibility


• Analyze experimental data and translate findings into process improvements


• Basic reliability testing literacy in TCT, HAST, MSL.

Innovation & Continuous Improvement

• Explore new lithography and fabrication techniques to improve resolution and performance


• Contribute to continuous improvement of fabrication workflows and process capability

Requirements

• Bachelor's degree in physics, Chemistry, Materials Science, Electrical Engineering, Mechanical Engineering, or a related field.


• Minimum 7 years of combined experience in microfabrication processes with demonstrated cleanroom proficiency from either an academic or industry background, and the ability to support seamless process integration


• Hands-on experience with commonly used photoresist coating, exposure, and development tools and processes.


• Knowledge of PID materials for interposer buildup.


• Experience with etching processes (ICP, RIE, CCP, and wet etching)


• Experience in metallization and thin-film deposition (PECVD, PVD, etc.)


• Experience working in semiconductor-grade cleanroom environments

Preferred Qualifications

• Master's or PhD in Physics, Chemistry, Materials Science, Electrical Engineering, Mechanical Engineering, or a related field


• 10+ years of combined experience in microfabrication processes with demonstrated cleanroom proficiency from either an academic or industry background


• Experience in the semiconductor industry, particularly in advanced packaging or interposer/substrate build-up

Why Choose Syenta?

We’re building a team that takes ownership, moves fast, and solves meaningful technical challenges. At Syenta, you’ll play a central role in shaping a breakthrough manufacturing technology and see your work translate directly into real-world impact.

What We Offer

• Early-stage equity opportunities


• Potential 401(k) and other benefits


• Comprehensive health, dental, and vision coverage plans, supported by Company


• Professional Growth – We’re scaling fast, so responsibilities can expand significantly in tandem with the business


• Team Events – Annual company event in Australia to collaborate and celebrate


• Work-Life Balance – An understanding that meaningful work can coexist with a fulfilling personal life


• 15 days PTO and 10 days sick leave

Syenta is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, age, or any other characteristic protected by law.