Senior Silicon Photonics & Optical Packaging Engineer

Apple Inc.; Austin (TX); Hybrid; USD 150,000 - 230,000; Full time

Job summary

Apple Inc. is seeking a experienced Silicon Photonics & Optical Packaging Engineer to lead packaging architecture for SiPh devices, fibers, and co-packaging modules at our Austin site.

You will drive design, simulation, and qualification of optical I/O solutions to deliver high performance and manufacturability. In this role you will collaborate with process, electrical, and reliability teams, manage projects across global vendors, and travel internationally as needed to advance next-generation

Qualifications

• BS and 10+ years of relevant industry experience.
• Preferred MS/PhD in physics, optics, EE or related field.
• Excellent teamwork and communication skills.

Responsibilities

• Design and model silicon photonic devices and interconnects, optimizing coupling, thermal, and signal integrity performance.
• Develop optical packaging architectures integrating photonic chips, fibers, and electronics using tools like Lumerical, Zemax, or COMSOL.
• Prototype and characterize integrated photonic packages, correlating simulation with optical and electrical measurements.
• Collaborate with cross-functional teams (process, electrical, mechanical, reliability) to enable scalable, manufacturable designs.
• Document results and present technical findings through reports, reviews, or relevant forum presentations contributing to next-generation optical I/O development.

Skills

Optics knowledge

Teamwork

Communication

Education

BS in related field

MS or PhD in Physics/Optics/EE or related

Tools

Lumerical

Zemax

COMSOL

Job description

Apple Inc. is seeking a experienced Silicon Photonics & Optical Packaging Engineer to lead packaging architecture for SiPh devices, fibers, and co-packaging modules at our Austin site.

You will drive design, simulation, and qualification of optical I/O solutions to deliver high performance and manufacturability. In this role you will collaborate with process, electrical, and reliability teams, manage projects across global vendors, and travel internationally as needed to advance next-generation