Senior Silicon Packaging Engineer: NPI & IC Assembly

Starlink; Bastrop (TX); On-site; USD 125,000 - 190,000; Full time

Job summary

SpaceX is seeking a Sr. Silicon Packaging Process Engineer for Starlink to own packaging modules from concept through mass production. You will drive wafer-level and chip-level packaging technologies, selecting equipment and materials to meet quality, cost, and yield targets.

In this role you will coordinate with IC design, materials, thermal, and production teams, lead NPI/NTI efforts, and bring advanced packaging solutions to next generation SpaceX products.

Qualifications

• Bachelor's degree in engineering or related field.
• 5+ years in semiconductor assembly and packaging.
• Experience with wafer-level and chip-level packaging processes.

Responsibilities

• Own packaging processes from concept to mass production.
• Develop and baseline packaging technologies and assembly methods.
• Lead NPI/NTI for packaging lines and ensure release to production.
• Manage equipment/material selection to meet quality and cost targets.
• Interface with suppliers for continuous improvement and cost reductions.
• Collaborate with IC design, materials, thermal, and production teams.
• Implement advanced packaging solutions in SpaceX products.

Skills

Flip-chip packaging

BGA

fcCSP

WLCSP

Fan-out" packaging

SiP

MCM

Panel-level packaging

Heterogeneous integration

Chiplet integration

Packaging assembly

Education

Bachelor's degree in electrical engineering

Bachelor's degree in mechanical engineering

Bachelor's degree in chemical engineering

Bachelor's degree in materials science

Bachelor's degree in physics

Advanced technical degree

Tools

Wafer grinding

Wafer dicing

Lithography

Lamination

Plating

Etching

SMT

Flip chip

Bonding

Molding

Underfill

Dispense

Sputter

Lid attach

Solder ball attach

Job description

SpaceX is seeking a Sr. Silicon Packaging Process Engineer for Starlink to own packaging modules from concept through mass production. You will drive wafer-level and chip-level packaging technologies, selecting equipment and materials to meet quality, cost, and yield targets.

In this role you will coordinate with IC design, materials, thermal, and production teams, lead NPI/NTI efforts, and bring advanced packaging solutions to next generation SpaceX products.