Sr. Silicon Packaging Process Engineer, Silicon Technology (Starlink)

SPACE EXPLORATION TECHNOLOGIES CORP; Bastrop (TX); On-site; USD 100,000 - 130,000; Full time

Job summary

SPACE EXPLORATION TECHNOLOGIES CORP is hiring a Sr. Silicon Packaging Process Engineer in Bastrop, TX. This role includes owning packaging assembly processes from concept to mass production and developing new technologies for wafer-level and chip-level systems. Required qualifications include a Bachelor's degree in electrical, mechanical, or other relevant engineering fields and 5+ years of experience in semiconductor assembly and packaging. The position promotes innovation and vertical integration to enhance Starlink's global impact.

Qualifications

• 5+ years of professional experience in semiconductor assembly and packaging.
• Familiarity with flip-chip, BGA, and other packaging processes.

Responsibilities

• Own packaging assembly processes from concept to mass production.
• Develop new technologies for assembly and packaging.
• Select equipment and material to meet production targets.

Skills

Semiconductor assembly and packaging

Packaging process development

Equipment selection

Education

Bachelor’s degree in relevant engineering discipline

Job description

Sr. Silicon Packaging Process Engineer, Silicon Technology (Starlink)

Bastrop, TX

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.

SpaceX is leveraging its experience in building rockets and spacecraft to deploy Starlink, the world’s most advanced broadband internet system. Starlink is the world’s largest satellite constellation and is providing fast, reliable internet to 4M+ users worldwide. We design, build, test, and operate all parts of the system – thousands of satellites, consumer receivers that allow users to connect within minutes of unboxing, and the software that brings it all together. We’ve only begun to scratch the surface of Starlink’s potential global impact. As we continue to upgrade and expand the constellation, we’re looking for best-in-class engineers to join the team.

In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing. We are looking for hands‑on and dynamic engineers with expertise in semiconductor packaging design, process development, equipment, and test. You will assume full ownership of packaging products and process modules and take them from concept to mass production as we strive to make Starlink more affordable to those who need it most.

Responsibilities

• Own packaging assembly processes from concept to mass production including equipment and material selection for wafer‑level and chip‑level systems
• Develop new technologies and establish baselines for assembly and packaging including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach
• Bring‑up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines
• Own packaging prototypes, product development and release to production
• Select equipment and material to meet quality, reliability, cost, yield, and production targets
• Interface with equipment and material suppliers including continuous improvement plans, cost reduction, and productivity improvements
• Cross‑functional interface with IC design, materials, thermal, systems, and production teams
• Implement advanced packaging solutions into SpaceX next generation products

Basic Qualifications

• Bachelor’s degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or other applied engineering discipline
• 5+ years of professional experience in semiconductor assembly and packaging

Preferred Skills and Experience

• Advanced technical degree
• 7+ years industry experience with microelectronics packaging development
• Packaging familiarity with flip‑chip, BGA, fcCSP, WLCSP, fan out FO processes, system‑in‑package SiP, multi‑chip modules MCM, panel level packaging, heterogeneous and chiplet integration
• Hands‑on packaging, PCB, PCBA, or SMT assembly experience
• OSAT (outsource semiconductor assembly and test) experience a plus
• To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful permanent resident (green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State.

Equal Employment Opportunity

SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.