Sr. IC Packaging Test Engineer, Silicon Technology (Starlink)

Remote

San Francisco (CA)

On-site

USD 150,000 - 210,000

Full time

13 days ago

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Job summary

SpaceX’s Starlink team seeks a Sr. IC Packaging Test Engineer in Silicon Technology to own packaging and wafer test development for production.

You will collaborate with in-house designers and test equipment suppliers to build robust, cost-effective test solutions for high-volume manufacturing. You will define equipment, write automated test programs, perform schematic reviews, and advance RF/high-speed testing capabilities for next-generation SpaceX products.

Qualifications

  • Bachelor’s degree in an engineering or physics field.
  • 5+ years programming in C/C++/Visual/Python.
  • Experience in semiconductor packaging or wafer testing.
  • Strong knowledge of RF and high-speed testing.

Responsibilities

  • Own electrical test equipment definition for packaging and wafer production testing.
  • Bring-up test equipment and programs for mass manufacturing.
  • Create automated test equipment (ATE) test programs and plans.
  • Define testing requirements to ensure product conformance.
  • Schematic and electrical reviews of test equipment.
  • Collaborate with suppliers to implement features and productivity improvements.
  • Develop advanced testing solutions for next-generation products.

Skills

C/C++/Visual/Python programming
Electrical testing expertise

Education

Bachelor’s degree in electrical engineering, computer engineering, computer science, physics, or other applied engineering discipline

Tools

Automated Test Equipment (ATE)
RF testing
SERDES testing
Probe card design

Job description

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.

Sr. IC PACKAGING TEST ENGINEER, SILICON TECHNOLOGY (STARLINK)

Starlink believes in providing fast, reliable internet to those that need it most. We design, build, and launch the world's largest and most advanced satellite constellation that is capable of delivering high-speed internet to even the most remote locations. We also design, build, and ship the hardware that sits in the homes of our customers all around the world. And while our hardware and network are incredibly advanced, we keep the end-user experience impressively simple - our customers have internet within 10 minutes of unboxing.

In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing. We are looking for talented hands‑on and dynamic test engineers with expertise in semiconductor packaging and wafer test. You will work closely with test equipment manufacturers and in‑house chip & system designers to develop and release production test solutions. You will assume full ownership of packaged component and wafer test as we strive to make Starlink more affordable to those that need it most.

RESPONSIBILITIES:
  • Own electrical test equipment definition for packaging and wafer level production testing
  • Bring‑up of test equipment and test programs for mass manufacturing
  • Create automated test equipment (ATE) test programs and test plans
  • Define full and comprehensive testing requirements to ensure product conformance
  • Schematic and electrical review for all test equipment
  • Supplier test interface for implementing new features, cost, and productivity improvements
  • Implement advanced testing solutions for SpaceX next generation products
BASIC QUALIFICATIONS:
  • Bachelor’s degree in electrical engineering, computer engineering, computer science, physics, or other applied engineering discipline
  • 5+ years of programming experience in C/C++/Visual/Python
PREFERRED SKILLS AND EXPERIENCE:
  • 10+ years industry experience with microelectronics packaging development
  • Advanced technical degree
  • Expertise in developing digital, high-speed and RF semiconductor test programs for production
  • Strong RF test knowledge
  • Experience with digital, high speed SERDES, RF, and mixed signal testing
  • Wafer sort, wafer probe, probe card design and test experience
  • Custom socket and wafer prober design and test experience
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