Distinguished Signal and Power Integrity Engineer

2100 NVIDIA USA; Santa Clara (CA); On-site; USD 320,000 - 489,000; Full time

Benefits offered by this job

Equity

Benefits

Job summary

NVIDIA Corporation seeks a Distinguished Signal & Power Integrity Engineer to lead high-speed signaling and packaging strategies across AI and HPC platforms, based in Santa Clara.

You will mentor teams, guide R&D and production efforts on EMIB/UCIe/DDR/PCIe standards, and collaborate with leadership to shape future interconnect technologies and co-packaged optics.

Qualifications

• 15+ years leading high-speed signaling innovations spanning semiconductor assembly technologies and computational electromagnetics.
• MS/PhD in Electrical Engineering or equivalent.
• Experience with EMIB, UCIe, CPO, and high-density connectors.
• Ability to manage and mentor teams of engineers from research to high-volume manufacturing.

Responsibilities

• Lead development and execution of corporate-level strategies for high-speed signaling technologies across packaging, sockets, and connectors.
• Oversee technical direction for next-gen products from ultra-mobile to AI/HPC platforms.
• Architect interconnect and packaging solutions for standards like UCIe, HBM, DDR, PCIe, and SerDes.
• Develop modeling and characterization flows and design-for-manufacturing techniques.
• Provide strategic counsel to senior leadership on emerging technologies and research priorities.

Skills

High-speed signaling

Electromagnetics

Semiconductor assembly

Mentoring teams

Education

MS/PhD in Electrical Engineering

Job description

We are now looking for a Distinguished Signal & Power Integrity Engineer! NVIDIA has continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI — the next era of computing. NVIDIA is a “learning machine” that constantly evolves by adapting to new opportunities that are hard to solve, that only we can tackle, and that matter to the world. This is our life’s work, to amplify human imagination and intelligence. This is a dynamic team working with state of the art, unique technology. If you are someone that loves a challenge, come join this diverse team and help move the needle!

What you'll be doing:

Lead the development and execution of corporate-level strategies for high-speed signaling technologies across advanced semiconductor packaging, sockets, and connectors. Oversee technical direction and implementation for next-gen products ranging from ultra-mobile to high-performance AI and HPC platforms. Architect and deliver state-of-the-art interconnect and packaging solutions for standards such as UCIe, HBM, DDR, PCIe, and industry-leading SerDes (224G/448G). Enable advanced packaging technology solutions for co-packaged optics, stacked die, chiplet-based architectures and IVR solutions . Development of modeling and characterization flows, flow automations, design for high volume manufacturing techniques. Offer strategic counsel as a recognized subject matter expert to senior leadership on emerging technologies, technology investment, and research priorities in signaling, packaging, and system integration

What we need to see:

15+ years leading innovations spanning high-speed signal integrity, computational electromagnetics, and semiconductor assembly technologies. MS/PhD in Electrical Engineering or equivalent with 15+ years of industry experience. Hands‑on invention and deployment of advanced solutions e.g., EMIB, UCIe, CPO, high density connectors. Deep experience with electrical, computer, and packaging engineering and deployment of such in products Demonstrated ability to manage and mentor teams of highly skilled engineers, define methodologies, and deliver complex projects from research to high-volume manufacturing

Ways to stand out from the crowd:

An industry veteran with proven track record of bringing advanced SI concepts from research to product A known pioneer in any industry standard high speed signaling technology Deep knowledge of operation and manufacturing challenges of package substrate, PCB, cables and connectors

Your base salary will be determined based on your location, experience, and other objective job-related factors. The expected base salary range for this position is 320,000 USD – 488,750 USD. You will also be eligible for equity and benefits. Applications for this job will be accepted at least until November 10, 2026. This posting is for an existing vacancy. NVIDIA uses AI tools in its recruiting processes. NVIDIA is committed to fostering an inclusive work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law. NVIDIA pioneered accelerated computing. Today, our AI infrastructure powers global intelligence, transforming every industry. Learn more about NVIDIA.