Senior RFIC Design Engineer - LNA & Modules

Skyworks Solutions, Inc.; Hillsboro (OR); On-site; USD 109,000 - 227,000; Full time

Benefits offered by this job

Healthcare benefits

401(k) with company match

Employee stock purchase plan

Paid time off

Job summary

Skyworks Solutions, Inc. in the United States is seeking an RFIC Design Engineer to design RF front end modules for mobile wireless applications, including LNA and switches, with cross-functional collaboration.

You will work with a core design team to bring cutting-edge wireless products to market, performing transistor-level RFIC design, simulations, layout, and verification testing, and supporting integration into multi-chip modules with RF measurements.

Qualifications

• Demonstrated RFIC design released to production in RF CMOS/SOI/BiCMOS.
• Proficient in RFIC EDA tools Cadence and Keysight ADS.
• Experience with EM simulators HFSS, FEM, and ADS Momentum.
• MSEE with 5+ years of directly applicable experience or PhD in related field.

Responsibilities

• Design RF front end modules for mobile wireless applications with LNA and switches.
• Define product requirements with engineering and marketing managers.
• Create and execute design, simulation, layout, and verification testing.
• Support RFIC integration into a multi-chip module (MCM) and RF measurements.
• Document results and present to internal/external customers; conduct peer reviews.

Skills

RFIC design experience

Cadence & ADS proficiency

HFSS / ADS Momentum experience

Education

MSEE with 5+ years of experience

PhD in a related field

Tools

Cadence

Keysight ADS

HFSS

ADS Momentum

Job description

Skyworks Solutions, Inc. in the United States is seeking an RFIC Design Engineer to design RF front end modules for mobile wireless applications, including LNA and switches, with cross-functional collaboration.

You will work with a core design team to bring cutting-edge wireless products to market, performing transistor-level RFIC design, simulations, layout, and verification testing, and supporting integration into multi-chip modules with RF measurements.