Senior Regional Thermal Solutions Engineer – Asia

Vinci

United States

Remote

USD 180,000 - 280,000

Full time

14 days+

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Job summary

Vinci is seeking a senior leader to build and coach a high-performing thermal engineering team in Asia. You will drive adoption of our physics AI platform among top engineering organizations and lead technical demonstrations for enterprise customers.

As a trusted advisor, you will balance engineering rigor with business storytelling, guiding PoCs, simulations, and decisions that improve thermal reliability, power density, and time-to-market for next‑gen hardware.

Qualifications

  • Bachelor's degree in Mechanical or Electrical Engineering or closely related field.
  • 15+ years hands-on thermal management experience with signaling/packaging expertise.
  • Experience in customer-facing roles and enterprise software sales.
  • Fluency in Mandarin or Korean is preferred.

Responsibilities

  • Build and lead a high-performing team of thermal engineers across Asia.
  • Drive PoC evaluations, technical discussions, and compelling product demonstrations to strategic customers.
  • Oversee simulation setup, results interpretation, and value storytelling to emphasize thermal performance improvements.
  • Collaborate with Sales, Product, and Engineering to incorporate field feedback into product directions.

Skills

Thermal engineering leadership
Enterprise technical sales
Python/C++ scripting
Executive communication

Education

Mechanical or Electrical Engineering degree

Tools

Flotherm
Ansys Icepak/Fluent
Simcenter STAR-CCM+
Python
C++

Job description

Vinci is seeking a senior leader to build and coach a high-performing thermal engineering team in Asia. You will drive adoption of our physics AI platform among top engineering organizations and lead technical demonstrations for enterprise customers.

As a trusted advisor, you will balance engineering rigor with business storytelling, guiding PoCs, simulations, and decisions that improve thermal reliability, power density, and time-to-market for next‑gen hardware.

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