Realtime Defect Analysis Engineer - Tech Development

Micron

Boise (ID)

On-site

USD 90,000 - 120,000

Full time

14 days+
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Job summary

Micron Technology in Boise, Idaho, is seeking a Realtime Defect Analysis Engineer to join the Advanced Packaging Technology Development team. You will investigate process anomalies, perform data manipulation and root-cause analysis, and collaborate across process integration, data science, and yield analysis to accelerate learning and technology transfer.

The ideal candidate has a strong foundation in semiconductor engineering, experience with defect analysis, scripting, and an interest in

Qualifications

  • Bachelor’s degree in Electrical Engineering, Chemical Engineering, Materials Science & Engineering, or related field plus 2–4 years of semiconductor industry experience.
  • At least 1 year of RDA experience identifying and resolving defect integration issues.
  • Knowledge of semiconductor fabrication techniques.
  • Basic data science/data manipulation skills (scripting, coding, programming).
  • Strong understanding of physics, area chemistry, and semiconductor equipment concepts.
  • Ability to use AI-enabled tools for operational and efficiency purposes.

Responsibilities

  • Review and analyze experimental process flows, looking for defect anomalies and quarantining process tools that are out of control.
  • Use inline process signals to drive process improvements.
  • Work with new inspection tools and strategies to drive earlier detection of problems and identify the sources.
  • Recognize, identify, and raise awareness of process anomalies with the approach of "who needs to know this now?"
  • Build and improve upon techniques and identify new ways to use existing tools in order to identify relevant process issues.
  • Actively participate in technical meetings and then synthesize new opportunities or novel approaches.
  • Collaborate with the global network to develop best-known methods and maintain alignment between sites.

Skills

Electrical Engineering
Semiconductor manufacturing
Data science
AI tools
Scripting

Education

Bachelor's in EE/CE/MSE

Tools

SEM
X-ray inspection
Laser inspection systems

Job description

Micron Technology in Boise, Idaho, is seeking a Realtime Defect Analysis Engineer to join the Advanced Packaging Technology Development team. You will investigate process anomalies, perform data manipulation and root-cause analysis, and collaborate across process integration, data science, and yield analysis to accelerate learning and technology transfer.

The ideal candidate has a strong foundation in semiconductor engineering, experience with defect analysis, scripting, and an interest in

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