Senior R&D Scientist, Copper Plating for Interconnects

Qnity Electronics, Inc.; Marlborough (MA); On-site; USD 140,000 - 210,000; Full time

Job summary

Qnity Electronics, Inc. is seeking a Senior R&D Scientist to lead the development of copper electroplating solutions for dual damascene interconnect applications. You will design, formulate, and scale Cu plating chemistries to improve fill performance, reliability, and manufacturing productivity.

The role sits at the intersection of electrochemistry, materials science, and semiconductor process integration, collaborating with customers to deliver next-generation memory solutions.

Qualifications

• Ph.D. in a relevant technical discipline is required.
• Strong understanding of electrochemistry and metal electrodeposition.
• Experience designing and analyzing statistically driven experiments.
• Proven record of technical innovation and problem solving.
• Excellent communication and presentation skills.
• Ability to work in multidisciplinary, customer-facing environments.

Responsibilities

• Lead R&D of copper electroplating chemistries for dual damascene interconnect fabrication.
• Design experiments to optimize Cu fill in high aspect ratio trenches and vias.
• Develop novel additive systems with suppressors, accelerators, levelers, and components.
• Investigate plating mechanisms using electrochemical and materials characterization methods.
• Collaborate with process integration, analytical, engineering, and manufacturing teams.
• Support scale-up from lab development to pilot manufacturing and customer qualification.
• Engage with leading semiconductor customers to translate requirements into roadmaps.
• Drive IP generation through invention disclosures, patents, and publications.
• Present technical results to customers, management, and industry conferences.
• Monitor industry trends in metallization and BEOL integration.

Skills

Experimental design

Cross-functional collaboration

Communication

Problem solving

Presentation skills

Education

Ph.D. in Chemistry / Chemical Engineering / Materials Science / Electrochemistry

Tools

Cyclic voltammetry

EIS

Chronoamperometry

Chronopotentiometry

Rotating disk electrode

Job description

Qnity Electronics, Inc. is seeking a Senior R&D Scientist to lead the development of copper electroplating solutions for dual damascene interconnect applications. You will design, formulate, and scale Cu plating chemistries to improve fill performance, reliability, and manufacturing productivity.

The role sits at the intersection of electrochemistry, materials science, and semiconductor process integration, collaborating with customers to deliver next-generation memory solutions.