Senior Technical Associate

Qnity Electronics, Inc.; Marlborough (MA); On-site; USD 65,000 - 95,000; Full time

Job summary

Qnity Electronics, Inc. is seeking an innovative and hands-on R&D Associate Scientist to advance copper electroplating chemistries for dual damascene semiconductor interconnects.

The role collaborates with senior scientists and cross-functional teams to develop, test, and optimize processes for future technology nodes. You will drive formulation development, electrochemical testing, process characterization, and customer-focused tech advances while building metallization expertise.

Qualifications

• B.S. in Chemistry, Chemical Engineering, Materials Science, Electrochemistry, or related field.
• Experience with laboratory experiments and data analysis.
• Strong problem-solving and attention to detail.
• Excellent written and verbal communication.
• Ability to collaborate in a team-oriented R&D environment.
• Demonstrated initiative and ownership of research activities.

Responsibilities

• Plan and execute laboratory research supporting copper electroplating chemistries for dual damascene applications.
• Prepare and evaluate plating formulations, additives, and process conditions.
• Execute electrochemical experiments and characterize plating performance.
• Perform defect analysis and metrology using microscopy and EDS/FIB-SEM.
• Analyze data, identify follow-up experiments, and guide product development decisions.
• Support scale-up, manufacturing transfer, and customer qualification activities.
• Maintain lab equipment, documentation, and safety compliance.
• Collaborate with senior scientists, engineers, and manufacturing teams.
• Prepare technical reports and presentations of findings.
• Contribute to IP through invention disclosures and patent development.

Skills

Problem solving

Communication

Teamwork

Initiative

Troubleshooting

Education

B.S. in Chemistry, Chemical Engineering, Materials Science, Electrochemistry

Tools

FIB-SEM

EDS

Job description

We are seeking an innovative and hands‑on R&D Associate Scientist to support the development of next‑generation copper electroplating products for advanced dual damascene semiconductor interconnect applications. This role will work closely with a Senior R&D Scientist and multidisciplinary technical teams to develop, evaluate, and optimize Cu plating chemistries and processes that enable future semiconductor technology nodes.

The successful candidate will proactively contribute to formulation development, electrochemical testing, process characterization, and customer‑focused technology development while building expertise in advanced semiconductor metallization. The candidate will be expected to propose and drive experiments, troubleshoot technical challenges, and identify productive next steps.

Key Responsibilities

• Plan and execute laboratory research supporting the development of advanced copper electroplating chemistries for dual damascene applications.
• Prepare and evaluate plating formulations, additive packages, and process conditions.
• Execute electrochemical experiments and characterize plating performance using established analytical techniques.
• Perform defect analysis and feature‑fill characterization using advanced microscopy and metrology tools such as FIB-SEM, EDS, etc.
• Analyze experimental data, identify follow‑up experiments, and provide recommendations to guide product development decisions.
• Support technology scale‑up, manufacturing transfer, and customer qualification activities.
• Maintain laboratory equipment, experimental documentation, and safety compliance.
• Collaborate closely with senior scientists, engineers, analytical teams, and manufacturing organizations.
• Prepare technical reports, presentations, and summaries of research findings.
• Contribute to intellectual property generation through invention disclosures and patent development.

Required Qualifications

• B.S. in Chemistry, Chemical Engineering, Materials Science, Electrochemistry, or a related technical field.
• Strong foundation in electrochemistry, materials science, or wet chemical process development.
• Experience conducting laboratory experiments and analyzing technical data.
• Strong problem‑solving skills and attention to detail.
• Effective written and verbal communication skills.
• Ability to work collaboratively in a team‑oriented R&D environment.
• Demonstrated initiative and willingness to propose experimental approaches, pursue technical questions, and take ownership of assigned research activities.

Preferred Qualifications

• Academic or industrial experience in metal electroplating or surface finishing technologies.
• Familiarity with semiconductor processing, interconnect technologies, or advanced packaging.
• Knowledge of electrochemical characterization methods.
• Experience with statistical experimental design and data analysis tools.
• Exposure to process development and product commercialization activities.