Senior Process Engineer

ProFound People Pty Ltd; Phoenix (AZ); On-site; USD 110,000 - 170,000; Full time

Job summary

ProFound People Pty Ltd in Phoenix seeks a Senior Process Engineer for copper electroplating to advance cutting-edge semiconductor manufacturing. You will translate lab-scale copper deposition processes into stable, repeatable production workflows and collaborate with R&D and manufacturing teams.

The role requires 5+ years in electroplating or electrochemical process development, with strong background in copper plating, semiconductor fabs, and process transfer to pilot lines.

Qualifications

• 5+ years of hands-on experience in electroplating or electrochemical process development.
• Strong experience with copper electroplating or similar metal deposition systems.
• Background in semiconductor manufacturing, advanced packaging.

Responsibilities

• Translate lab-scale processes into stable, repeatable manufacturing workflows.
• Support process transfer to pilot lines and external fabrication partners.
• Contribute to process development for copper plating in semiconductor fabs (FEOL/BEOL) and related environments.

Skills

Electroplating

Copper plating

Electrochemistry

Semiconductor manufacturing

Process transfer

Education

Bachelor's degree in Chemistry, Electrochemistry, Materials Science, or Chemical Engineering

Job description

Senior Process Engineer - Copper Electroplating

Strong Salary + Equity opportunities + 401k match

This is an incredible opportunity to work on cutting-edge technology which is changing the semiconductor industry.

This is a high-impact role where you’ll play a key part in developing cutting-edge precision manufacturing processes for next‑generation micro‑scale technologies.

This company is creating a new fabrication process which can improve the compute ability of chips considerably.

After receiving strong funding and HUGE amounts of industry interest, they are adding to their R&D function in the form of a Process Engineer for Copper Plating.

Translating lab‑scale processes into stable, repeatable manufacturing workflows is critical for this opportunity.

Some requirements & additional info.

• Degree in Chemistry, Electrochemistry, Materials Science, or Chemical Engineering
• 5+ years of hands‑on experience in electroplating or electrochemical process development
• Support process transfer to pilot lines and external fabrication partners
• Strong experience with copper electroplating or similar metal deposition systems
• Background in semiconductor manufacturing, advanced packaging.
• Experience in semiconductor fabs (FEOL/BEOL plating, RDL, bumping) or OSAT environments